AIXTRON SE

Regulatory Filings • Jul 10, 2006

News Details

Corporate | 10 July 2006 06:00

Aixtron AG: AIXTRON receives first order for merged ALD and AVD® technologies

Corporate news transmitted by DGAP – a company of EquityStory AG. The issuer is solely responsible for the content of this announcement. —————————————————————————— AIXTRON receives first order for merged ALD and AVD® technologies Aachen, Germany – July 10, 2006 – AIXTRON AG, a leading manufacturer of deposition equipment to the global semiconductor industry, today announced that it has received the first system order from a leading Asian memory manufacturer for a combined Genus 300 mm Atomic Layer Deposition (ALD) StrataGem and Atomic Vapor Deposition (AVD®) technologies. This order represents a progressive step into next-generation solutions for High-k Dielectrics in DRAM Capacitor sub 45nm high volume production. DRAM technology continues to be a major driver of innovations in process technology and manufacturing equipment for Genus products. Installation will start during third quarter 2006; revenues will be booked in the second half of 2006. One year after the completion of the AIXTRON – Genus merger, the new entity reaps further significant benefits from its strength in product development. ALD and AVD® technologies have already demonstrated that they can overcome many of the limitations of current film deposition techniques. The process modules combining ALD and AVD® technologies will be installed at the customer’s purpose-built 300 mm R&D fab, are a driving force into mainstream/HV semiconductor processing. The joint development program represents an important step forward in strengthening AIXTRON’s position for providing enabling deposition solutions for these emerging semiconductor applications. The initial work will focus on: – Evaluation of various high-k dielectrics and metal gate materials for large-scale production purposes – Integration of those materials into high-k gate stacks & advanced DRAM capacitors – Optimization of DRAM and CMOS device structures for Sub-45nm. Dr. William W. R. Elder, the Member of AIXTRON’s Executive Board responsible for all of AIXTRON’s silicon business interests comments: “Many of Genus’ primary customers are major chip manufacturers in the memory (DRAM and FLASH) segment of the semiconductor industry. The process modules are based on a patented process chamber concept and have achieved a leading position for the deposition of tungsten silicide (WSix) and high-k materials, primarily used in memory and capacitor applications. With ALD, AVD® technologies and the company’s core tungsten silicide CVD platform, we are now able to offer our customers a full and comprehensive portfolio of semiconductor process technologies.” For further information on AIXTRON AG (FSE: AIX, ISIN DE0005066203; NASDAQ: AIXG) please consult our website at: www.aixtron.com. Forward-Looking Statements This news release may contain forward-looking statements about the business, financial condition, results of operations and earnings outlook of AIXTRON within the meaning of the ‘safe harbor’ provisions of the United States Private Securities Litigation Reform Act of 1995. Words such as ‘may’, ‘will’, ‘expect’, ‘anticipate’, ‘contemplate’, ‘intend’, ‘plan’, ‘believe’, ‘continue’ and ‘estimate’, and variations of these words and similar expressions, identify these forward-looking statements. The forward-looking statements reflect our current views and assumptions and are subject to risks and uncertainties. You should not place undue reliance on the forward-looking statements. The following factors, and others which are discussed in AIXTRON’s public filings and submissions with the U.S. Securities and Exchange Commission, are among those that may cause actual and future results and trends to differ materially from our forward-looking statements: actual customer orders received by AIXTRON; the extent to which chemical vapor deposition, or CVD, technology is demanded by the market place; the timing of final acceptance of products by customers; the financial climate and accessibility of financing; general conditions in the thin film equipment market and in the macro-economy; cancellations, rescheduling or delays in product shipments; manufacturing capacity constraints; lengthy sales and qualification cycles; difficulties in the production process; changes in semiconductor industry growth; increased competition; exchange rate fluctuations; availability of government funding; variability and availability of interest rates; delays in developing and commercializing new products; general economic conditions being less favorable than expected; and other factors. The forward-looking statements contained in this news release are made as of the date hereof and AIXTRON does not assume any obligation to update or revise any forward-looking statements, whether as a result of new information, future events or otherwise, unless required by law. Contact: Investor Relations and Corporate Communications AIXTRON AG, Kackertstr. 15–17, 52072 Aachen, Germany Phone: +49 241 8909 444, Fax: +49 241 8909 445, invest@aixtron.com www.aixtron.com (c)DGAP 10.07.2006 ————————————————————————— Language: English Issuer: AIXTRON AG Kackertstr. 15-17 52072 Aachen Deutschland Phone: +49 (0)241 8909-444 Fax: +49 (0)241 8909-445 E-mail: invest@aixtron.com WWW: www.aixtron.com ISIN: DE0005066203 WKN: 506620 Indices: TecDAX Listed: Geregelter Markt in Frankfurt (Prime Standard); Freiverkehr in Berlin-Bremen, Stuttgart, München, Hamburg, Düsseldorf; Foreign Exchange(s) Nasdaq End of News DGAP News-Service —————————————————————————