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SÜSS MicroTec SE

Investor Presentation • Feb 2, 2011

422_ip_2011-02-02_e77411f6-f2c6-42de-95c1-8f178c0b9485.pdf

Investor Presentation

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Close Brothers Seydler Bank AG Small and Mid Cap Conference 2011

Disclaimer

This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its subsidiaries and associates. Forward-looking statements are based on current plans, estimates, projections and expectations and are therefore subject to risks and uncertainties, most of which are difficult to estimate and which in general are beyond the control of SUSS MicroTec AG.Consequently, actual developments as well as actual earnings andperformance may differ materially from those which are explicitly or implicitly assumed in the forward-looking statements. SUSS MicroTec AG does not intend or accept any obligation to publish updates of these forward-looking statements.

Content

  • I.Executive Summary
  • II.Products and Markets
  • III.Strategic Restructuring
  • IV.Growth Opportunities
  • V.Financials
  • VI.Outlook
  • VII.Appendix

SUSS MicroTec Spotlight

  • SUSS MicroTec: A global equipment leader in semiconductors
  • Our equipment and process solutions create the micro structures that build and connect micro electronic devices

We are focused on high growth market segments:

Semiconductors, MEMS, LEDs

  • 2010 order entry app. 190 million €
  • 2010 guidance:
  • Sales 140 million €
  • EBIT range 11 13 million €
  • More than 8,000 systems installed worldwide

SUSS MicroTec – a Global Player

Major Milestones

  • Explosive growth in order entry
  • Acquisition of HamaTech APE
  • Divestment of the loss making Test Systems division
  • Relocation of the Substrate Bonder division from Waterbury, USA to Sternenfels, Germany
  • Reduction of development and manufacturing sites from existing four in January 2010 to two highly efficient sites in Germany in 2011

Content

  • I.Executive Summary
  • II.Products and Markets
  • III.Strategic Restructuring
  • IV.Growth Opportunities
  • V.Financials
  • VI.Outlook
  • VII.Appendix

SUSS MicroTec In The Value Chain

Mega Trends Driving our Key Markets

Enabling Semiconductor Trends

SUSS MicroTec drives and enables the fundamental challenges of the semiconductor Industry:

Shrinking – Stacking – Integrating

The SUSS MicroTec family of products provides equipment and process solutions for 2-dimensional and 3-dimensional scaling

Semiconductors

  • SUSS MicroTec offers solutions for performance and yield critical steps in semiconductor manufacturing
  • Front End: Mask Cleaning
  • Back End: Advanced Packaging 3D Integration

Mask Cleaning

Maintains mask integrity of 193i sub 22nm, EUVL and NIL lithography

Advanced Packaging

Micro-bumping replaces wire-bonding for high-end integrated circuits

3D Integration

Stacking chips allows for higher device complexity

MEMS and LED

MEMS

  • Micromechanical devices with electrical functions
  • Micro Electro Mechanical Systems are found in a wide application range from automotive over industrial process control sensors to consumer products

LED

  • Ultra High Brightness Light Emitting Diodes ( UHB LED) for solid state lighting
  • UHB LEDs drive rapidly growing LED markets like automotive, consumer electronics and lightingapplications
  • For MEMS and LED production SUSS MicroTec offers a comprehensive suite of products:Mask Aligners – Coaters / Developers – Wafer Bonders

Products and Process Solutions

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From Advanced Packaging to 3D Integration

  • Technical and economical limitations increasingly slow down the shrink roadmap of integrated circuits

  • Going into the third dimension by stacking chips allows for higher integrated devices and shifts the emphasis from size reduction and transistor improvements to advancements in interconnect performance.

  • 3D integration promises greater space efficiency, lower power consumption and a significant increase in performance.

  • SUSS MicroTec develops equipment and processes for 3D Integration

3D Integration: Chip Design Using the Third Dimension

Content

  • I.Executive Summary
  • II.Products and Markets
  • III.Strategic Restructuring
  • IV.Growth Opportunities
  • V.Financials
  • VI.Outlook
  • VII.Appendix

Strategic Restructuring Measures

Readjustments of Product Lines

  • •Sold loss making Test Systems division
  • •Acquired Hamatech APE
  • •Relocated the Substrate Bonder Division from the US to Germany

Consolidation of Production Sites

  • •From four at the beginning of 2010 to two by Q1, 2011
  • •Moved three product lines under one roof in Sternenfels
  • •Established Sternenfels as the main SUSS production site

Resizing of Field Offices to Meet Current and Future Business Requirements

  • •Closed Bangkok office
  • •Reduced size of the Japan office
  • •Increased Taiwan and China organizations
  • •Consolidated "Rest of Asia" in Singapore
  • •Moved US sales and service organization to Silicon Valley

The Sternenfels Production Site

  • Large production site (15.000 sqm) with two large clean rooms
  • Meets modern production and clean room standards
  • Supports anticipated expansion of business
  • Three product lines centered under one roof
  • Photomask Equipment
  • Coater / Developer
  • Bonder
  • Synergies within the development and production

Reduction of development and production sites from existing four in January 2010 to two highly efficient sites in Germany for the future

Content

  • I.Executive Summary
  • II.Products and Markets
  • III.Strategic Restructuring
  • IV.Growth Opportunities
  • V.Financials
  • VI.Outlook
  • VII.Appendix

Growth Opportunities – Short Term

Worldwide semiconductor revenue

  • -2009 app. \$228 billion
  • -2010 app. \$300 billion (31.5% increase from 2009)
  • -2011 app. \$314 billion (4.6% increase from 2010)

Semiconductor Equipment Growth

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"Certain equipment segments will have substantially higher growth. Demand for equipment for advanced processes, such as wafer-level packaging, 3D processes and TSV manufacturing, is expected to grow faster than the overall market" (Gartner) "Certain equipment segments will have substantially higher growth. Demand for equipment for advanced processes, such as wafer-level packaging, 3D processes and TSV manufacturing, is expected to grow faster than the overall market"(Gartner)

Growth Opportunities - Longterm

  • The longterm growth perspective derives from the double digit growth rates of the target markets 3D Integration, Advanced Packaging, LED and MEMS
  • Equipment purchases are mainly driven by
  • Capacity increases in established markets -Advanced Packaging, LED, MEMS
  • New technologies in emerging markets like 3D Integration
    • -Thin wafer handling
    • permanent and temporary bonding of wafer stacks
    • -TSV (Through Silicon Vias)
  • Leading edge process solutions for high volume front end manufacturing
    • -Photomask cleaning solution for technology nodes 32nm and smaller

Growth Opportunities - Longterm

  • Wafer bonding steps are increasingly yield and performance critical in the manufacturing of 3D Integration, LED and MEMS devices
  • SUSS MicroTec is one of the leading supplier for substrate bonders in the semiconductor industry
  • 3D applications will lead to a sharp increase in permanent as well as temporary bonding applications
  • With the new modular XBC300 Bonder platform an extremely competitive cluster system was successfully introduced to the market
  • SUSS MicroTec is the only bonder equipment supplier that offers a variety of processes for "Thin Wafer Handling"
  • The wafer bonder equipment market alone is estimated at 530 M\$ in 2013 (Source: Yole, May 2010)
  • SUSS MicroTec targets a market share of 30%+ which is in line with current numbers

The Wafer Bonder Equipment Market

The Wafer Bonder Equipment Market is estimated at 530 M\$ in 2013

Content

  • I.Executive Summary
  • II.Products and Markets
  • III.Strategic Restructuring
  • IV.Growth Opportunities
  • V.Financials
  • VI.Outlook
  • VII.Appendix

Key Financials 9M 2010

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33 Months Business Development

Segment Reporting 9M 2010

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Cash Flow Statement 9M 2010

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Content

  • I.Executive Summary
  • II.Products and Markets
  • III.Strategic Restructuring
  • IV.Growth Opportunities
  • V.Financials
  • VI.Outlook
  • VII.Appendix

Outlook

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Thank you!

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