SUSS MICROTEC INVESTOR PRESENTATION
March 2012
This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its subsidiaries and associates. Forward-looking statements are based on current plans, estimates, projections and expectations and are therefore subject to risks and uncertainties, most of which are difficult to estimate and which in general are beyond the control of SUSS MicroTec AG. Consequently, actual developments as well as actual earnings and performance may differ materially from those which explicitly or implicitly assumed in the forwardlooking statements. SUSS MicroTec AG does not intend or accept any obligation to publish updates of these forward-looking statements.
TABLE OF CONTENT
- I. SUSS MicroTec at a Glance
- II. Products and Markets
- III. Growth Opportunities
- IV. Financials
- V. Outlook
SUSS MICROTEC AT A GLANCE
* February 29, 2012
OPTIMIZING STRUCTURES – SHAPING THE FUTURE
Garching
- SÜSS MicroTec AG HQ
- Development and production:
- Mask Aligner
- Bond Aligner
- Core competencies:
- Exposure
- Alignment
Sternenfels
- Development and production :
- Bonder
- Coater and Developer
- Photomask Equipment
- Core competencies:
- Wet processing
- Wafer bonding
SUSS MICROTEC – A GLOBAL PLAYER
ORDER INTAKE AND SALES BY REGION 9M 2011
TABLE OF CONTENT
- I. SUSS MicroTec at a Glance
- II. Products and Markets
- III. Growth Opportunities
- IV. Financials
- V. Outlook
SUSS MICROTEC IN THE VALUE CHAIN
- Key player in providing state-of-the-art semiconductor manufacturing equipment
- Development of highly innovative systems with industry and R&D partners
- Components for cell phones, PCs and tablet computers are produced on SUSS MicroTec"s equipment
SEGMENTS AND PRODUCTS
SEGMENTS AND MARKETS
SEGMENTS AND PRODUCTION SITES
KEY MARKETS
TABLE OF CONTENT
- I. SUSS MicroTec at a Glance
- II. Products and Markets
- III. Growth Opportunities
- IV. Financials
- V. Outlook
MEGA TRENDS DRIVING THE INDUSTRY
- Global mega-trends drive the microelectronics industry and create long term opportunities
- Digital Lifestyle
- E-Mobility
- Energy efficiency
- Micro chips, MEMS und LEDs are the building blocks for the technological product advancement
- SUSS MicroTec"s focus is to offer development and manufacturing solutions for these components in markets that have a sustainable long term growth perspective
Digital lifestyle
E-mobility
Energy efficiency
- The further increase in complexity and performance of future semiconductor device generations demands the continuous progress in scaling of these devices
- SUSS MicroTec"s equipment and process solutions enable the 2-dimensional reduction of feature sizes ("Moore's Law") as well as the 3-dimensional stacking of integrated circuits ("More than Moore")
2D VS. 3D SCALING
- Technical challenges and limitations make it increasingly more expensive to pursue the shrink roadmap of integrated circuits
-
While alternatives like 3D integration promise greater space efficiency, lower power consumption and a significant increase in performance they will not replace shrinking
-
For the years to come shrinking and stacking technologies will coexist, each having it"s unique set of challenges
- SUSS MicroTec is one of the few companies offering production equipment and process solutions for 2-dimensional and 3-dimensional scaling
GROWTH OPPORTUNITIES
- The company"s long term growth perspective derives from the double digit growth rates of the target markets 3D Integration, Advanced Packaging, LED and MEMS
- SUSS MicroTec is one of the leading suppliers for wafer bonders in the semiconductor industry offering a broad portfolio of permanent and temporary bonding equipment and process solutions
- The wafer bonder equipment market is estimated to grow rapidly to a size of larger 500 million \$ within the next few years
- SUSS MicroTec targets a market share of 30%+ which is in line with the current market position
Source: Yole Développement
OVERVIEW ON TEMPORARY BONDING: TRADITIONAL VS. NEW PROCESSES
New Trend:
Mechanical Room Temperature Release / Release Layer Approaches
Traditional Methods:
Thermal Slide
WaferBOND™ HD-3007 Wafer Support System Laser Release
Source: Yole Developpement
MARKET FORECAST II
Source: Yole Developpement
- Three product lines under one roof
- Photomask Equipment Coater / Developer Bonder
- Modern production facility (15,000 m²) with two large clean rooms supporting future business expansion
TABLE OF CONTENT
- I. SUSS MicroTec at a Glance
- II. Products and Markets
- III. Growth Opportunities
IV. Financials
V. Outlook
36 MONTHS BUSINESS DEVELOPMENT
EBIT, FREE CASH FLOW AND NET CASH DEVELOPMENT
25 SUSS MicroTec Investor Presentation
| in € million |
2011 |
2010 |
in % |
|
|
|
|
| Order Intake |
143.1 |
189.3 |
-24% |
| Order Backlog (12/31) |
83.7 |
116.1 |
-28% |
| Revenue |
175.4 |
139.1 |
26% |
| EBIT |
18.6 |
14.3 |
30% |
| EBIT in % of Sales |
10.6% |
10.3% |
0.3% pt |
|
|
|
|
| Free Cash Flow* |
3.5 |
14.1 |
-75% |
| Net Cash** |
42.0 |
34.1 |
23% |
* Before consideration of purchase or sale of available-for-sale securities and before consideration of extraordinary items from purchase or sale of subsidiaries
** incl. interest-bearing securities
TABLE OF CONTENT
- I. SUSS MicroTec at a Glance
- II. Products and Markets
- III. Growth Opportunities
- IV. Financials
- V. Outlook
Investment Case
- Strong competitive positioning: first or second in the target markets
- Expansion of the solid financial situation and increasing profitability
- Strong fundamental growth in target markets
- Significant mid term revenue opportunity
- Evolve to a leading company in the semiconductor backend, enabling 3D integration while supporting "Moore"s Law" as well as "More than Moore"
- Participate in the consolidation of the backend
SÜSS MicroTec AG Schleissheimer Str. 90 85748 Garching
www.suss.com