Investor Presentation • Jan 23, 2013
Investor Presentation
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January 2013
This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its subsidiaries and associates. Forward-looking statements are based on current plans, estimates, projections and expectations and are therefore subject to risks and uncertainties, most of which are difficult to estimate and which in general are beyond the control of SUSS MicroTec AG. Consequently, actual developments as well as actual earnings and performance may differ materially from those which explicitly or implicitly assumed in the forwardlooking statements. SUSS MicroTec AG does not intend or accept any obligation to publish updates of these forward-looking statements.
We are focused on high growth market segments: Semiconductors, MEMS, LEDs
Key Data:
Photomask Equipment
Coater/Developer
Wafer Bonders
Alignment Verification Systems
Digital lifestyle
E-mobility
Energy efficiency
Complementary technologies like Wafer Level Packaging (WLP) and 3 Dimensional Chip Stacking (3DIC) circumvent the deficiencies of traditional scaling and allow increasing density and functionality at lower cost
This extension beyond the conventional shrink roadmap is called "More than Moore"
SUSS MicroTec is one of the few companies offering a comprehensive equipment and process solution spectrum for WLP and 3DIC
With its strong position in the fast growing target markets 3D Integration / Advanced Packaging, LED and MEMS, SUSS MicroTec can benefit from the expected market developments:
Advanced Packaging (wafer level packaging and flip chip)
remains more robust than the overall market, primarily driven by smart phones and tablets
expected to transition to production volume in the years to come
Compound Semi (LED, MEMS, RF, Optoelectronics, III-V Power)
expected to remain robust based on smartphone and tablet growth and will drive further demand for advanced packaging solutions
SUSS MicroTec"s equipment and process solutions enable
3-dimensional stacking of integrated circuits ("More than Moore")
I. SUSS MicroTec at a Glance
Increasing chip performance requires adoption of innovative lithography technologies in the semiconductor backend
New fab allows to move from one shift (8h/5d) to 24/7 operation
I. SUSS MicroTec at a Glance
VI. Outlook
| in € million | Q3 2012 | Q3 2011 | in % | 9M 2012 | 9M 2011 | in % |
|---|---|---|---|---|---|---|
| Order Intake | 36.6 | 38.2 | -4.2% | 117.0 | 118.6 | -1.3% |
| Order Backlog (09/30) | -- | -- | -- | 102.4 | 103.5 | -1.1% |
| Revenue | 40.7 | 45.9 | -11.3% | 108.2 | 130.6 | -17.2% |
| EBIT | 1.6 | 4.1 | -61.0% | 3.1 | 14.7 | -78.9% |
| EBIT in % of Sales | 3.9% | 8.9% | -- | 2.9% | 11.3% | -- |
| Earnings after tax (cont. operations) | 0.4 | 2.9 | -86.2% | 0.8 | 11.2 | -92.9% |
| Earnings after tax | 0.4 | 2.9 | -86.2% | 2.3 | 11.2 | -79.5% |
| EPS in € (basic) | 0.02 | 0.15 | -86.7% | 0.12 | 0.59 | -79.7% |
| Free Cash Flow* | 0.9 | 4.5 | -80.0% | -6.2 | 2.0 | <-100% |
| Net Cash** | -- | -- | -- | 30.7 | 40.1 | -23.4% |
| Employees (09/30) | -- | -- | -- | 699 | 637 | +9.7% |
* before consideration of purchased interest-bearing securities and M&A activities
** incl. stock of interest-bearing securities
| Guidance | FY 2012: Q4 2012: |
- Sales between 160 and 170 € million - EBIT between 5 and 10 € million - Order Intake 25 – 40 € million |
||
|---|---|---|---|---|
| Investment Case | Strong fundamental growth in target markets Strong competitive positioning: first or second in the target markets Leading equipment company in the semiconductor backend, enabling "Moore"s Law" as well as "More than Moore" Significant mid term revenue opportunity Play active role in the consolidation of the backend |
SÜSS MicroTec AG Schleissheimer Str. 90 85748 Garching
www.suss.com
Tel.: +49 (0) 89-32007- 161 Fax.: +49 (0) 89-32007- 451 Email: [email protected]
SÜSS MicroTec AG Schleissheimer Strasse 90 85748 Garching (Munich) Germany www.suss.com
| Cheuvreux German Corporate Conference, Frankfurt/Main | 21. Jan. |
|---|---|
| Annual Report 2012 | 28. Mar |
| Quarterly Report 2013 | 8. May |
| Commerzbank German Midcap Conference, Boston/New York | 22./23. May |
| Shareholders" Meeting, Haus der Bayerischen Wirtschaft, Munich |
19. Jun. |
| Interim Report 2013 | 8. Aug. |
| Commerzbank TMT Conference, Frankfurt | 28. Aug |
| UBS Best of Germany Conference, New York | 16. - 18. Sep |
| UniCredit/Kepler Investment Conference, Munich | 24. - 26. Sep |
| Baader Investment Conference, Munich | 24. - 26. Sep |
| Nine-month Report 2013 | 7. Nov. |
| German Equity Forum, Frankfurt/Main | 11. - 13. Nov |
SÜ SS M icroTec, indexed TecD A X , indexed Prime IG Semiconduct or, indexed
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