SÜSS MicroTec SE

Investor Presentation • Nov 14, 2013

SUSS MICROTEC INVESTOR PRESENTATION

November 2013

This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its subsidiaries and associates. Forward-looking statements are based on current plans, estimates, projections and expectations and are therefore subject to risks and uncertainties, most of which are difficult to estimate and which in general are beyond the control of SUSS MicroTec AG. Consequently, actual developments as well as actual earnings and performance may differ materially from those which explicitly or implicitly assumed in the forwardlooking statements. SUSS MicroTec AG does not intend or accept any obligation to publish updates of these forward-looking statements.

TABLE OF CONTENT

I. SUSS MicroTec at a Glance

• II. Products and Markets
• III. Growth Opportunities
• IV. Enhanced Lithography Portfolio
• V. Financials
• VI. Outlook

SUSS MICROTEC AT A GLANCE

• SUSS MicroTec: A global leader in semiconductor equipment
• Our equipment and process solutions create the micro structures that build and connect micro electronic devices
• We are focused on high growth market segments: Semiconductors, MEMS, LEDs

Key Data:

• Stock Exchange Symbol: SMHN
• Share price*: 7.83 €
• Market Cap*: 150 € million
• Net Cash, September 30, 2013: 21.9 € million

* October 31, 2013

SUSS MICROTEC IN THE VALUE CHAIN

• Key player in providing state-of-the-art semiconductor manufacturing equipment
• Development of highly innovative process solutions with industry and R&D partners
• Components for electronic devices like cell phones, PCs and tablet computers are produced on SUSS MicroTec's equipment

THE SEMICONDUCTOR MARKET

SUSS MICROTEC – A GLOBAL PLAYER

MAIN PRODUCTION SITES

Germany USA

Garching

• SUSS MicroTec HQ
• Development/production:
• Mask Aligner
• Bond Aligner
• Core competencies:
• Exposure (proximity exposure)
• Alignment

Sternenfels

• Development/production :
• Bonder
• Coater and Developer
• Photomask Equipment
• Core competencies:
• Wet processing
• Wafer bonding

Corona

• Development/production:
• Stepper/Scanner
• Laser Processing
• Core competencies:
• Exposure (UV projection lithography)
• Laser Ablation

TABLE OF CONTENT

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Enhanced Lithography Portfolio
• V. Financials
• VI. Outlook

KEY MARKETS

Reevaluation of the business situation in permanent bonding

• ongoing losses
• expansion of the restructuring measures, which have been taken in Q2, 2013
• Cease production of cluster systems for permanent bonding applications
• Losses of the Substrate Bonding Division will be reduced significantly
• The successful manual permanent bonding systems are not affected
• Extraordinary expenses of € 6.0 million in Q2 2013
• € 4.6 million value adjustments on capitalized development costs from the years prior to 2008, demonstration equipment, and other inventories
• € 1.4 million provisions for commitments and other agreements
• Extraordinary expenses of € 8.3 million will be taken in Q4 2013:
• € 6.7 million for write-offs on raw materials, unfinished goods and demonstration tools
• € 1.6 million for precautionary formed accruals for single customer projects

• Cumulative expenses for the restructuring of permanent bonding in 2013 will amount to approximately € 14.3 million

• I. SUSS MicroTec at a Glance

• II. Products and Markets
• III. Growth Opportunities
• IV. Enhanced Lithography Portfolio
• V. Financials
• VI. Outlook

TECHNOLOGY EVOLUTION

14 SUSS MicroTec Investor Presentation

GROWTH DRIVER SMARTPHONES AND TABLETS

Source: Yole Developpement

MICROCHIPS, MEMS UND LED: BUILDING BLOCKS FOR TECHNOLOGICAL PRODUCT ADVANCEMENT

Digital Lifestyle	- The "Digital Lifestyle" is characterized by permanent internet connectivity and convergence of media - Mobile devices like smartphones and tablet PCs provide this capability at affordable cost - New device generations offer higher functionality
E-Mobility	- Alternative transportation / mobility solutions are getting more traction with attractive price / performance ratios - EVs, Hybrid-Cars, Segways, E-Bikes, but also trains drive the need for power devices but also high performance ICs
Energy Efficiency	- Increase environmental awareness and rising energy prices and fuel the demand for energy efficient solutions in electricity usage i.e. lighting - Energy efficiency in industrial production - Smart energy management in household applications safes energy

With its strong position in the fast growing target markets 3D Integration / Advanced Packaging, LED and MEMS, SUSS MicroTec can benefit from the market developments:

Advanced Packaging	Wafer level packaging and flip chip is expected to remain more robust than the overall market, primarily driven by mobile devices like smart phones and tablets
3D Integration (TSV)	Transition to production volume in the years to come
Compound Semiconductors	LED, MEMS, RF, Optoelectronics, III-V Power are expected to remain robust based on smartphone and tablet growth and will drive further demand for advanced packaging solutions

Segment growth 2011 - 2016E CAGR ~ 15% (Gartner and industry estimates)

SCALING TECHNOLOGIES FROM 2D TO 3D

2D Packaging 2.5D Packaging 3D Integration (TSV) - Combining of several (and heterogeneous) semiconductor components on an interposer addresses limitations of traditional shrinking - Increased packaging density - Reduced footprint - Complementary technology to Moore's Law - The extension beyond the conventional shrink roadmap is called "More than Moore" - Packaging becomes key enabler for scaling and some manufacturing value is shifting from silicon to the package - Performance and complexity increase combined with smaller footprint - Reduced energy consumption - Increased performance and complexity of ICs by shrinking transistor geometry according to Moore's Law - New technologies like EUV and multiple pattering allow further scaling - Technical challenges and limitations make it increasingly more difficult and expensive to reduce the feature size

SUSS MicroTec"s equipment and process solutions enable 2D shrinking ("Moore's Law") and 3D stacking ("More than Moore")

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities

IV. Enhanced Lithography Portfolio

• V. Financials
• VI. Outlook

LITHOGRAPHY COMPETENCY

• Increasing chip performance requires the adoption of innovative lithography technologies in the semiconductor backend
• Not one single exposure technology fits all needs at the same time
• The newly acquired Stepper/Scanner products supplement our Mask Aligner product line and enlarges our technology portfolio by the key competencies UV-projection lithography and laser ablation
• SUSS MicroOptics S.A. adds key know how for critical lithography performance improvements

EXPOSURE SOLUTIONS

Only SUSS MicroTec offers complete exposure solutions for the mid-/back-end

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Enhanced Lithography Portfolio

V. Financials

VI. Outlook

LONG TERM BUSINESS DEVELOPMENT

EBIT, FREE CASH FLOW AND NET CASH DEVELOPMENT

in € million	Q3 2013	Q3 2012	in %	9M 2013	9M 2012
Order Intake	34.3	36.6	-6.3%	105.9	117.0
Order Backlog 9/30	--	--	--	97.6	102.4
Revenue	38.9	40.7	-4.4%	94.0	108.2
EBIT	1.8	1.6	+12.5%	-13.2	3.1
EBIT in % of Sales	4.6%	3.9%	--	-14.0%	2.9%
EBIT (adjusted)	1.8	1.6	+12.5%	-7.2	3.5
EBIT (adjusted) in % of Sales	4.6%	3.9%	--	-7.6%	3.2%
Earnings after tax (continuing operations)	1.2	0.4	>100%	-10.5	0.8
Earnings after tax	1.2	0.4	>100%	-10.5	2.3
EPS in € (continued op.)	0.06	0.02	>100%	-0.55	0.04
Free Cash Flow*	2.5	0.9	>100%	-9.9	-6.2
Net Cash**	--	--	--	21.9	30.7
Employees 9/30	--	--	--	673	699

* before consideration of purchased interest-bearing securities , the acquisition of Tamarack and the gain out of the sale from the Test Business

** incl. stock of interest-bearing securities

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Enhanced Lithography Portfolio
• V. Financials
• VI. Outlook

2013:	-	Milestone achievement in temporary bonding
-------	---	--------------------------------------------	--	--

• - Restructuring of product line Permanent Bonding expanded
• - Further integration of SUSS MicroTec Photonic Systems

Fundamental growth in target markets

Strong competitive positioning: first or second in the target markets

Leading equipment company in the semiconductor backend, enabling "Moore"s Law"as well as "More than Moore"

Outlook

FY 2013: - Sales of 125 – 135 € million - EBIT: minus 22 – minus 27 million € (thereof 14.3 € million one-off charges)

Q4 2013: - Order Intake 30 - 40 € million

- One-off charges 8.3 € million

SÜSS MicroTec AG Schleissheimer Str. 90 85748 Garching

www.suss.com

Franka Schielke

Tel.: +49 (0) 89-32007- 161 Fax.: +49 (0) 89-32007- 451 Email: franka.schielke@suss.com

SÜSS MicroTec AG Schleissheimer Strasse 90 85748 Garching (Munich) Germany www.suss.com

Contact Financial Calendar 2013/2014

Nine-month Report 2013	7. Nov.
German Equity Forum, Frankfurt/Main	11. - 13. Nov
Morgan Stanley TMT Conference, Barcelona	21. - 22. Nov
KeplerCheuvreux Investment Conference, Frankfurt	20.-22. Jan
Annual Report 2013	28. Mrz.
Quarterly Report 2014	8. Mai.
Shareholders' Meeting, Haus der Bayerischen Wirtschaft, Munich	17. Jun.
Interim Report 2014	7. Aug.
Nine-month Report 2014	6. Nov.

OUR TECHNOLOGY ENABLES SUSTAINABILITY

Equipment	Applications	Initiatives
- SUSS MicroTec equipment is designed to efficiently use electricity and chemicals - ReMan, the remanufacturing operation of SUSS MicroTec takes back used equipment and refurbishes it	- 3D IC and chip scaling helps reducing energy and material consumption - LEDs for efficient lighting	- Partner company of VDMA BlueCompetence initiative, a network of equipment providers in Germany, who are following a sustainable business approach
	solutions - MEMS applications improve performance of mobile devices and conserve energy - Shift to renewable energies	- Innovative lighting solution in Sternenfels - Improved climatization system of cleanrooms
	requires more power devices and high-performance ICs (e.g. for solar and wind power systems) - Laser Ablation in lieu of photolithography (seed layer removal)	- Paperless invoice system

SUSS MICROTEC PRODUCT PORTFOLIO