SÜSS MicroTec SE

Investor Presentation • Aug 6, 2015

SUSS MICROTEC INVESTOR PRESENTATION

August 2015

DISCLAIMER

This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its subsidiaries and associates. Forward-looking statements are based on current plans, estimates, projections and expectations and are therefore subject to risks and uncertainties, most of which are difficult to estimate and which in general are beyond the control of SUSS MicroTec AG. Consequently, actual developments as well as actual earnings and performance may differ materially from those which explicitly or implicitly assumed in the forwardlooking statements. SUSS MicroTec AG does not intend or accept any obligation to publish updates of these forward-looking statements.

TABLE OF CONTENT

I. SUSS MicroTec at a Glance

• II. Products and Markets
• III. Growth Opportunities
• IV. Financials
• V. Strategy Update and Outlook

SUSS MICROTEC AT A GLANCE

• A global leader in manufacturing equipment for the semiconductor mid- and backend market
• Our equipment and process solutions create the micro structures that build and connect micro electronic devices
• Focus on attractive growth markets: Semiconductors, MEMS and LED

Leading market position in target markets

Key figures 2014:

• Order Entry € 134.3 million
• Sales € 145.3 million
• Employees: 659

SUSS MICROTEC IN THE VALUE CHAIN

are produced on SUSS MicroTec's equipment

SUSS MICROTEC – A GLOBAL PLAYER

MAIN PRODUCTION SITES

*Production site is owned by SUSS MicroTec

TABLE OF CONTENT

I. SUSS MicroTec at a Glance

II. Products and Markets

• III. Growth Opportunities
• IV. Financials
• V. Strategy Update and Outlook

SEGMENTS, PRODUCTS AND MARKETS

* FY 2014, EBIT Segment Others: -4.5 € million H1 2015, EBIT Segment Others: -1.7 € million

Wafer-Fab Equipment Sales Semiconductor Equipment Sales by Region in 2014

in bn.

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TABLE OF CONTENT

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Financials
• V. Strategy Update and Outlook

+ The "Digital Lifestyle" is characterized by permanent internet connectivity and convergence of media + Digital Lifestyle Mobile devices like smartphones and tablet PCs provide this capability at affordable cost + New device generations offer higher functionality
-----------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------	--

	+ Alternative transportation / mobility solutions are getting more traction with attractive price / performance ratios
E-Mobility	+ EVs, Hybrid-Cars, Segways, E-Bikes, but also trains drive the need for power devices and high performance Ics at the same time

Energy Efficiency	+ Increased environmental awareness and rising energy cost drive the demand for energy efficient solutions i.e. solid state lighting
	+ Energy efficiency in industrial production
	+ Smart energy management in household applications

2D Packaging	2.5D Packaging	3D Integration (TSV)
- Increased performance and complexity of ICs by shrinking transistor geometry according to Moore's Law - New technologies like EUV and multiple pattering allow further scaling - Technical challenges and limitations make it increasingly more difficult and expensive to reduce the feature size	- Combining of several (and heterogeneous) semiconductor components on an interposer addresses limitations of traditional shrinking - Increased packaging density - Reduced footprint - Complementary technology to Moore's Law	- The extension beyond the conventional shrink roadmap is called "More than Moore" - Packaging becomes key enabler for scaling and some manufacturing value is shifting from silicon to the package - Performance and complexity increase combined with smaller footprint - Reduced energy consumption

SUSS MicroTec's equipment and process solutions enable 2D shrinking ("Moore's Law") and 3D stacking ("More than Moore")

TABLE OF CONTENT

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities

IV. Financials

V. Strategy Update and Outlook

Order Entry in € million Sales in € million

Order backlog in € million

Free Cash Flow in € million

Net cash in € million

EBIT in € million

* Including a -13.2 € milion one-off effect from restructuring of the product line permanant bonding (-0,69 € per share)

Order backlog in € million

Free Cash Flow EBIT in € million in € million

Net cash in € million

in € million	Q2 2015	Q2 2014	in %	H1 2015	H1 2014
Order Intake	41.2	36.2	13.8%	69.7	61.2
Order Backlog 6/30	--	--	--	91.4	77.7
Revenue	28.2	30.4	-7.2%	55.1	69.4
EBIT	-1.7	1.9	--	-3.9	3.4
EBIT in % of Sales	-6.0%	6.3%	--	-7.1%	4.9%
Earnings after tax	-2.1	0.9	--	-4.6	2.0
EPS in €	-0.11	0.05	--	-0.24	0.11
Free Cash Flow*	-7.7	1.8	--	-13.2	-2.4
Net Cash**	--	--	--	25.6	33.3
Employees 6/30	--	--	--	683	649

* incl. stock of interest-bearing securities

**before consideration of purchased interest-bearing securities

TABLE OF CONTENT

• I. SUSS MicroTec at a Glance
• II. Products and Markets
• III. Growth Opportunities
• IV. Financials

• V. Strategy Update and Outlook

• The recognized leader in Advanced Packaging

• The Trusted Choice for our customers
• A provider of Integrated Processing Solutions
• An Innovator and Enabler of customer roadmaps
• A Growth Company, as recognized by customers, peers, and investors

Achieve attractive revenue growth rates

• Expand Market Size for Existing Products
• Achieve further traction for Scanner products in Advanced Packaging (ADP: Fan Out, Cu Pillar)
• Leverage traditional Mask Aligner technology to win market share in growing MEMS market
• Reverse partial market share loss in Coater / Developer business with new high productivity platform and retrofitable upgrades for large installed base
• Explore new adjacent markets
• Grow Market Share
• Improve responsiveness and support for existing customers further in order to enable more repeat buys
• Define and implement a more targeted key (new) customer penetration strategy
• Focus Product Portfolio
• Target technology leadership through product differentiation in Advanced Packaging (ADP), MEMS, and FE segments to enable value propositions to our customers
• Target lowest Cost of Ownership and product cost in competitive commodity market environments

Reliable profitability, solid EBIT and cash generation

• Drive aggressive product cost of sales reduction programs to improve product gross margin
• Improve R&D and product release cycle time through Product Life Cycle management, change control methodology, clear priorities, accountabilities, and visible metrics

Business Environment/Targets

• Enabling "Moore's Law" and "More than Moore"
• Fundamental growth in target markets
• Leveraging the existing technologies and core competencies into products
• Grow revenue in the Lithography segment and bring the core business back to its former strength
• Position SUSS MicroTec Photonic systems tools in the market and grow revenue
• Generate a positive EBIT in the Substrate Bonder Division

Balance Sheet and P&L

• (Maintain) tight cost structure
• Strong financial position and positive free cash flow
• Equity ratio > 60%
• Target gross margins: short-term 33 – 35% medium-term >35%
• Medium-term EBIT-margin of 5%+

Guidance	FY 2015:	Sales: 135 - 145 € million EBIT: slightly positive
	Q3 2015: Q4 2015:	Order Intake: 25 - 35 € million Order Intake: 30 - 40 € million

SÜSS MicroTec AG Schleissheimer Str. 90 85748 Garching

www.suss.com

Franka Schielke

Tel.: +49 (0) 89-32007- 161 Fax.: +49 (0) 89-32007- 451 Email: franka.schielke@suss.com

SÜSS MicroTec AG Schleissheimer Strasse 90 85748 Garching (Munich) Germany www.suss.com

Contact Financial Calendar 2015

Interim Report 2015	6 Aug
Investment Conference Bankhaus Lampe, Zurich	27 Aug
TMT Conference Commerzbank, Frankfurt	9 Sep
German Corporate Conference, Berenberg/Goldman Sachs, Munich	23 Sep
Nine-month Report 2015	5 Nov
German Equity Forum 2015, Frankfurt am Main	23 - 25 Nov

SHARE PRICE DEVELOPMENT AND MAJOR HOLDERS

(Price of the SUSS MicroTec Share at January 2, 2015: 4.88 € )

Average daily trading volume January – July 2015: ~ 122,000 August 2015: ~ 137,000

LONG TERM BUSINESS DEVELOPMENT BY QUARTER

EBIT, FREE CASH FLOW AND NET CASH DEVELOPMENT

* one-off effect from restructuring the product line permanent bonding

THE SEMICONDUCTOR MARKET

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