X-

X-FAB

Specialty foundry for analog/mixed-signal ICs for auto, industrial, and medical markets.

XFB | PA

Overview

Corporate Details

ISIN(s):
BE0974310428
LEI:
5493003UDPENPUQBJH65
Country:
Belgium
Address:
Transportstraat 1, 3980 Tessenderlo
Sector:
Manufacturing
Industry:
Manufacture of electronic components and boards

Description

X-FAB is a global specialty foundry group focused on the fabrication of analog and mixed-signal integrated circuits. The company provides a comprehensive portfolio of modular process technologies and design IP, enabling customers to develop advanced semiconductor products. Its core technical expertise includes a wide range of CMOS and SOI processes, with geometries from 1.0 µm to 110 nm, as well as specialized capabilities in microsystems (MEMS), Silicon Carbide (SiC), and Gallium Nitride (GaN). X-FAB primarily serves as a manufacturing partner for clients in the automotive, industrial, and medical end markets, with additional applications in the consumer and mobile communications sectors.

Unlock This Filing & Millions More

You're one step away from the data you need. Create a free account to instantly view this filing and get access to powerful research tools.

Filings

You have of free filing views remaining. Upgrade for unlimited access.
Quick Filters:

Filters

Clear
Bulk Actions:
Date Filing Language Size Actions
2025-10-30 17:40
Earnings Release
Press Release_X-FAB_Q3_2025_Results_30Oct2025_ENG.pdf
English 364.1 KB
2025-10-30 17:40
Earnings Release
Press Release_X-FAB_Q3_2025_Results_30Oct2025_FR.pdf
French 370.3 KB
2025-09-02 17:40
Earnings Release
Press Release_X-FAB_Q2_2025_Results_31Jul2025_ENG.pdf
English 473.3 KB
2025-09-02 17:40
Earnings Release
Press Release_X-FAB_Q2_2025_Results_31Jul2025_FR.pdf
French 423.4 KB
2025-09-02 17:40
Interim Report
X-FAB_Half-Year_Report_2025_ENG.pdf
English 658.0 KB
2025-07-31 17:40
Earnings Release
Inside Information / News release on accounts, results
English 473.3 KB
2025-07-31 17:40
Earnings Release
Informations privilégiées / Communiqué sur comptes, résultats
French 423.4 KB
2025-04-28 15:45
Post-Annual General Meeting Information
Minutes_24Apr2025_NL_SIGNED.pdf
Dutch 6.0 MB
2025-04-24 07:00
Earnings Release
Informations privilégiées / Communiqué sur comptes, résultats
French 376.2 KB
2025-04-24 07:00
Earnings Release
Inside Information / News release on accounts, results
English 408.7 KB
2025-04-24 07:00
Earnings Release
Press_Release_X-FAB_Q1_2025_Results_24Apr2025_ENG.pdf
English 408.7 KB
2025-04-24 07:00
Earnings Release
Press_Release_X-FAB_Q1_2025_Results_24Apr2025_FR.pdf
French 376.2 KB
2025-03-25 17:40
Pre-Annual General Meeting Information
Right_to_add_items_to_the_agenda_2025_ENG.pdf
English 97.1 KB
2025-03-25 17:40
Proxy Solicitation & Information Statement
Proxy_2025_ENG.pdf
English 183.6 KB
2025-03-25 17:40
Pre-Annual General Meeting Information
Toelichting_vragenrecht_2025_NL.pdf
Dutch 75.3 KB

Automate Your Workflow. Get a real-time feed of all X-FAB filings delivered via API.

Explore Data Feeds →

Market Data

Market Data Not Available

Financials & KPIs

No data available

Unlock Full Financials for X-FAB

This data is available as part of our premium data solutions. Contact our team for access.

Need More History? Access decades of standardized financials for X-FAB via our API.

Get Historical Data →

Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

Peer Companies

Company Country Ticker View
HIROSE ELECTRIC CO.,LTD. Logo
Global manufacturer of high-performance connectors for auto, mobile, & industrial markets.
Japan 6806
HLB innoVation Co.,Ltd. Logo
Manufactures semiconductor lead frames for global markets and develops biotech treatments.
South Korea 024850
Manufactures LED packages and modules for automotive and general lighting applications.
South Korea 036170
HOKURIKU ELECTRIC INDUSTRY CO., LTD. Logo
Global manufacturer of electronic components, specializing in high-precision sensors.
Japan 6989
Hosiden Corporation Logo
Manufactures components like connectors & sensors for auto, IoT, mobile & AV applications.
Japan 6804
IBIDEN CO.,LTD. Logo
Global manufacturer of advanced PCBs, IC packages, and ceramic exhaust treatment components.
Japan 4062
Icape Holding S.A. Logo
Global distributor of PCBs and custom technical parts for high-tech industries worldwide.
France ALICA
Develops advanced patterned electronic materials and components for the global IT industry.
South Korea 368600
I&C Technology Co., Ltd. Logo
Designs wired & wireless communication SoCs and ASICs for smart grid and smart city sectors.
South Korea 052860
ICTK Co., Ltd. Logo
Fabless provider of PUF-based hardware security chips for IoT and payment systems.
South Korea 456010

Talk to a Data Expert

Have a question? We'll get back to you promptly.