WINPAC INC. Logo

WINPAC INC.

An OSAT partner providing semiconductor assembly, packaging, and testing for semiconductor firms.

097800 | KO

Overview

Corporate Details

ISIN(s):
N/A
LEI:
Country:
South Korea
Address:
경기도 용인시 처인구 백암면 청강가창로 50, 용인시
Sector:
Manufacturing
Industry:
Manufacture of electronic components and boards

Description

WINPAC INC. is a South Korea-based company engaged in the semiconductor business. The firm specializes in providing outsourced semiconductor assembly and testing (OSAT) services. Its primary offerings include the production of package products, such as fine pitch ball grid arrays (FBGA), and a range of testing solutions for semiconductor devices. The company serves as a key partner in the electronics supply chain, offering back-end manufacturing and quality assurance for other semiconductor companies.

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Date Filing Language Size Actions
2025-09-18 00:00
Share Issue/Capital Change
증권발행결과(자율공시)
Korean 6.5 KB
2025-09-09 00:00
Share Issue/Capital Change
주요사항보고서(유상증자결정)
Korean 40.9 KB
2025-08-14 00:00
Interim Report
반기보고서 (2025.06)
Korean 972.9 KB
2025-08-04 00:00
Capital/Financing Update
전환사채(해외전환사채포함)발행후만기전사채취득
Korean 11.0 KB
2025-08-04 00:00
Capital/Financing Update
신주인수권부사채(해외신주인수권부사채포함)발행후만기전사채취득
Korean 11.1 KB
2025-05-15 00:00
Quarterly Report
분기보고서 (2025.03)
Korean 931.1 KB
2025-05-02 00:00
Capital/Financing Update
전환가액의조정
Korean 12.6 KB
2025-05-02 00:00
Share Issue/Capital Change
신주인수권행사가액의조정
Korean 12.7 KB
2025-03-27 00:00
Post-Annual General Meeting Information
정기주주총회결과
Korean 19.1 KB
2025-03-26 00:00
Major Shareholding Notification
임원ㆍ주요주주특정증권등소유상황보고서
Korean 24.4 KB
2025-03-26 00:00
Major Shareholding Notification
임원ㆍ주요주주특정증권등소유상황보고서
Korean 24.4 KB
2025-03-24 00:00
Major Shareholding Notification
주식등의대량보유상황보고서(일반)
Korean 100.5 KB
2025-03-18 00:00
Audit Report / Information
감사보고서제출
Korean 17.8 KB
2025-03-18 00:00
Annual Report
사업보고서 (2024.12)
Korean 1.2 MB
2025-03-12 00:00
Pre-Annual General Meeting Information
주주총회소집공고
Korean 74.0 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

Peer Companies

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HIROSE ELECTRIC CO.,LTD. Logo
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HLB innoVation Co.,Ltd. Logo
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South Korea 024850
Manufactures LED packages and modules for automotive and general lighting applications.
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