TOWA CORPORATION Logo

TOWA CORPORATION

Manufacturer of semiconductor packaging equipment and precision molds for global chipmakers.

6315 | T

Overview

Corporate Details

ISIN(s):
N/A
LEI:
Country:
Japan
Address:
京都市南区上鳥羽上調子町5番地
Sector:
Manufacturing
Industry:
Manufacture of special-purpose machinery

Description

TOWA CORPORATION is a leading manufacturer of semiconductor manufacturing equipment, specializing in back-end packaging solutions. Established in 1979, the company's core business is centered on high-precision molding technologies. Its primary products include advanced molding equipment utilizing transfer and compression methods, singulation equipment, and ultra-precision molds for the resin sealing of semiconductors and other electronic components. TOWA also produces high-precision end mills and drills developed from its core manufacturing expertise. The company serves a global market of semiconductor manufacturers, emphasizing its commitment to research and development in new materials, micro-fabrication, and resin molding technologies, supported by a comprehensive global service network.

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Date Filing Language Size Actions
2025-06-30 03:21
Post-Annual General Meeting Information
臨時報告書
Japanese 23.3 KB
2025-06-26 02:11
Governance Information
内部統制報告書-第47期(2024/04/01-2025/03/31)
Japanese 23.8 KB
2025-06-26 02:07
Registration Form
確認書
Japanese 8.0 KB
2025-06-26 02:04
Annual Report
有価証券報告書-第47期(2024/04/01-2025/03/31)
Japanese 1.9 MB
2024-11-08 01:26
Regulatory News Service
確認書
Japanese 8.0 KB
2024-11-08 01:25
Interim Report
半期報告書-第47期(2024/04/01-2025/03/31)
Japanese 280.9 KB
2024-06-28 03:42
Post-Annual General Meeting Information
臨時報告書
Japanese 23.6 KB
2024-06-26 04:18
Governance Information
内部統制報告書-第46期(2023/04/01-2024/03/31)
Japanese 23.2 KB
2024-06-26 04:17
Registration Form
確認書
Japanese 8.0 KB
2024-06-26 04:16
Annual Report
有価証券報告書-第46期(2023/04/01-2024/03/31)
Japanese 1.8 MB
2024-02-08 02:11
Report Publication Announcement
確認書
Japanese 8.0 KB
2024-02-08 02:04
Quarterly Report
四半期報告書-第46期第3四半期(2023/10/01-2023/12/31)
Japanese 222.6 KB
2023-12-01 02:34
Audit Report / Information
臨時報告書
Japanese 19.7 KB
2023-11-09 02:24
Report Publication Announcement
確認書
Japanese 8.0 KB
2023-11-09 02:21
Quarterly Report
四半期報告書-第46期第2四半期(2023/07/01-2023/09/30)
Japanese 273.0 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

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