TOWA CORPORATION
Manufacturer of semiconductor packaging equipment and precision molds for global chipmakers.
6315 | T
Overview
Corporate Details
- ISIN(s):
- N/A
- LEI:
- Country:
- Japan
- Address:
- 京都市南区上鳥羽上調子町５番地
- Website:
- https://www.towajapan.co.jp/en/
- Sector:
- Manufacturing
- Industry:
- Manufacture of special-purpose machinery
Description
TOWA CORPORATION is a leading manufacturer of semiconductor manufacturing equipment, specializing in back-end packaging solutions. Established in 1979, the company's core business is centered on high-precision molding technologies. Its primary products include advanced molding equipment utilizing transfer and compression methods, singulation equipment, and ultra-precision molds for the resin sealing of semiconductors and other electronic components. TOWA also produces high-precision end mills and drills developed from its core manufacturing expertise. The company serves a global market of semiconductor manufacturers, emphasizing its commitment to research and development in new materials, micro-fabrication, and resin molding technologies, supported by a comprehensive global service network.
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Filings
| Date | Filing | Language | Size | Actions | |
|---|---|---|---|---|---|
| 2025-06-30 03:21 |
Post-Annual General Meeting Information
臨時報告書
|
Japanese | 23.3 KB | ||
| 2025-06-26 02:11 |
Governance Information
内部統制報告書－第47期(2024/04/01－2025/03/31)
|
Japanese | 23.8 KB | ||
| 2025-06-26 02:07 |
Registration Form
確認書
|
Japanese | 8.0 KB | ||
| 2025-06-26 02:04 |
Annual Report
有価証券報告書－第47期(2024/04/01－2025/03/31)
|
Japanese | 1.9 MB | ||
| 2024-11-08 01:26 |
Regulatory News Service
確認書
|
Japanese | 8.0 KB | ||
| 2024-11-08 01:25 |
Interim Report
半期報告書－第47期(2024/04/01－2025/03/31)
|
Japanese | 280.9 KB | ||
| 2024-06-28 03:42 |
Post-Annual General Meeting Information
臨時報告書
|
Japanese | 23.6 KB | ||
| 2024-06-26 04:18 |
Governance Information
内部統制報告書－第46期(2023/04/01－2024/03/31)
|
Japanese | 23.2 KB | ||
| 2024-06-26 04:17 |
Registration Form
確認書
|
Japanese | 8.0 KB | ||
| 2024-06-26 04:16 |
Annual Report
有価証券報告書－第46期(2023/04/01－2024/03/31)
|
Japanese | 1.8 MB | ||
| 2024-02-08 02:11 |
Report Publication Announcement
確認書
|
Japanese | 8.0 KB | ||
| 2024-02-08 02:04 |
Quarterly Report
四半期報告書－第46期第3四半期(2023/10/01－2023/12/31)
|
Japanese | 222.6 KB | ||
| 2023-12-01 02:34 |
Audit Report / Information
臨時報告書
|
Japanese | 19.7 KB | ||
| 2023-11-09 02:24 |
Report Publication Announcement
確認書
|
Japanese | 8.0 KB | ||
| 2023-11-09 02:21 |
Quarterly Report
四半期報告書－第46期第2四半期(2023/07/01－2023/09/30)
|
Japanese | 273.0 KB |
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Market Data
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Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
