TOKYO SEIMITSU CO., LTD.
Manufactures semiconductor equipment and precision measuring instruments.
7729 | T
Overview
Corporate Details
- ISIN(s):
- JP3580200008
- LEI:
- Country:
- Japan
- Address:
- 八王子市石川町２９６８番地２
- Website:
- https://www.accretech.com/en/
- Sector:
- Manufacturing
Description
TOKYO SEIMITSU CO., LTD., operating under the brand name ACCRETECH, is a manufacturer specializing in two core business segments: semiconductor manufacturing equipment and precision measuring instruments. The semiconductor division provides production systems for wafer probing, dicing, grinding, and chemical mechanical planarization (CMP), primarily supporting the test and assembly stages of semiconductor fabrication. The metrology division offers a comprehensive range of precision measuring instruments, including systems for analyzing surface texture, roundness, and contours, as well as coordinate measuring machines. These products provide solutions for both multi-purpose and in-line measurement across various manufacturing sectors.
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Filings
| Date | Filing | Language | Size | Actions | |
|---|---|---|---|---|---|
| 2025-11-05 03:11 |
確認書
|
Japanese | 8.9 KB | ||
| 2025-11-05 03:10 |
半期報告書－第103期(2025/04/01－2025/09/30)
|
Japanese | 235.9 KB | ||
| 2025-06-27 04:00 |
臨時報告書
|
Japanese | 26.3 KB | ||
| 2025-06-20 09:41 |
内部統制報告書－第102期(2024/04/01－2025/03/31)
|
Japanese | 24.5 KB | ||
| 2025-06-20 09:39 |
確認書
|
Japanese | 8.8 KB | ||
| 2025-06-20 09:37 |
有価証券報告書－第102期(2024/04/01－2025/03/31)
|
Japanese | 1.5 MB | ||
| 2024-11-05 06:13 |
確認書
|
Japanese | 8.9 KB | ||
| 2024-11-05 06:08 |
半期報告書－第102期(2024/04/01－2025/03/31)
|
Japanese | 242.7 KB | ||
| 2024-09-11 08:00 |
有価証券届出書（参照方式）
|
Japanese | 136.8 KB | ||
| 2024-06-26 07:21 |
臨時報告書
|
Japanese | 27.7 KB | ||
| 2024-06-24 05:05 |
内部統制報告書－第101期(2023/04/01－2024/03/31)
|
Japanese | 23.7 KB | ||
| 2024-06-24 05:03 |
確認書
|
Japanese | 8.8 KB | ||
| 2024-06-24 05:01 |
有価証券報告書－第101期(2023/04/01－2024/03/31)
|
Japanese | 1.4 MB | ||
| 2024-02-06 06:04 |
確認書
|
Japanese | 8.9 KB | ||
| 2024-02-06 06:02 |
四半期報告書－第101期第3四半期(2023/10/01－2023/12/31)
|
Japanese | 188.6 KB |
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Market Data
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Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
