TESEC Corporation Logo

TESEC Corporation

Manufactures automated testers and handlers for power, semiconductor, and MEMS devices worldwide.

6337 | T

Overview

Corporate Details

ISIN(s):
N/A
LEI:
Country:
Japan
Address:
東大和市上北台3丁目391番地の1
Sector:
Manufacturing
Industry:
Manufacture of special-purpose machinery

Description

TESEC Corporation is a global manufacturer that designs, develops, and sells semiconductor test equipment. Since launching its first test systems in 1969, the company has established itself as a key provider of solutions for engineering and production challenges in the semiconductor industry. Its primary product lines consist of automated test systems (testers) and device handlers, with a focus on power device testing and the handling of various semiconductor and MEMS device packages. TESEC is dedicated to innovation and providing comprehensive test solutions to a worldwide customer base.

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Date Filing Language Size Actions
2025-10-01 03:49
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 24.1 KB
2025-09-04 02:01
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 26.1 KB
2025-08-01 09:43
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 22.2 KB
2025-07-01 06:17
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 24.1 KB
2025-06-30 06:17
Regulatory News Service
臨時報告書
Japanese 21.0 KB
2025-06-25 08:34
Governance Information
内部統制報告書-第57期(2024/04/01-2025/03/31)
Japanese 23.2 KB
2025-06-25 08:32
Registration Form
確認書
Japanese 8.1 KB
2025-06-25 08:31
Annual Report
有価証券報告書-第57期(2024/04/01-2025/03/31)
Japanese 902.9 KB
2025-06-03 09:33
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 23.9 KB
2025-04-08 06:09
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 24.3 KB
2025-03-04 06:00
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 21.7 KB
2024-11-12 07:03
Regulatory News Service
確認書
Japanese 8.0 KB
2024-11-12 07:01
Interim Report
半期報告書-第57期(2024/04/01-2025/03/31)
Japanese 172.3 KB
2024-07-02 08:17
Post-Annual General Meeting Information
訂正臨時報告書
Japanese 24.3 KB
2024-06-28 04:18
Post-Annual General Meeting Information
臨時報告書
Japanese 21.8 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

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A global leader in custom automated motor winding systems for auto, EV, and appliance sectors.
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Makes optical thin film formation equipment for the optics, telecom, and semiconductor markets.
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