TECNISCO, LTD. Logo

TECNISCO, LTD.

Manufacturer of precision-processed components in glass, metal, and silicon.

2962 | T

Overview

Corporate Details

ISIN(s):
JP3545300000
LEI:
Country:
Japan
Address:
品川区南品川二丁目2番15号

Description

TECNISCO, LTD. is a manufacturer and service provider of precision-processed components, specializing in materials such as glass, metal, and silicon. The company utilizes its proprietary "Cross-edge" technology, which integrates five core processes: cutting, grinding, polishing, metalizing, and bonding. Its primary products include metal heatsinks for optical communication, industrial lasers, and power semiconductors, as well as glass components for display devices, sensors, mobile devices, and biotechnology/medical equipment. TECNISCO also produces drilling tools and processes other materials like ceramics and sapphire to meet diverse customer needs.

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Date Filing Language Size Actions
2025-09-26 09:21
確認書
Japanese 8.2 KB
2025-09-26 09:20
有価証券報告書-第57期(2024/07/01-2025/06/30)
Japanese 2.0 MB
2025-06-25 06:22
臨時報告書
Japanese 18.6 KB
2025-02-14 07:35
確認書
Japanese 8.1 KB
2025-02-14 07:35
半期報告書-第57期(2024/07/01-2025/06/30)
Japanese 159.9 KB
2024-09-30 04:25
臨時報告書
Japanese 22.1 KB
2024-09-27 07:18
内部統制報告書-第56期(2023/07/01-2024/06/30)
Japanese 22.0 KB
2024-09-27 07:15
有価証券報告書-第56期(2023/07/01-2024/06/30)
Japanese 1.9 MB
2024-09-27 07:15
確認書
Japanese 8.2 KB
2024-05-15 09:31
確認書
Japanese 8.2 KB
2024-05-15 09:30
四半期報告書-第56期第3四半期(2024/01/01-2024/03/31)
Japanese 130.3 KB
2024-02-14 07:31
確認書
Japanese 8.1 KB
2024-02-14 07:30
四半期報告書-第56期第2四半期(2023/10/01-2023/12/31)
Japanese 146.5 KB
2023-12-01 05:20
臨時報告書
Japanese 18.8 KB
2023-11-14 07:36
確認書
Japanese 8.1 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

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