TAZMO CO.,LTD Logo

TAZMO CO.,LTD

Manufactures advanced equipment for semiconductor & FPD production, including coaters and robots.

6266 | T

Overview

Corporate Details

ISIN(s):
N/A
LEI:
Country:
Japan
Address:
岡山市北区芳賀5311
Sector:
Manufacturing
Industry:
Manufacture of special-purpose machinery

Description

TAZMO CO., LTD. is a manufacturer of advanced production equipment for the semiconductor and flat-panel display (FPD) industries. The company's product portfolio includes a wide range of semiconductor manufacturing systems, such as coaters, developers, bonding/debonding systems, cleaning systems, and chemical distribution solutions. In the FPD sector, TAZMO is a notable market participant with its slit coaters for LCD color filter resist. The company also develops and manufactures high-precision clean transfer equipment, including wafer transfer robots recognized for their operational stability and reliability. Additionally, TAZMO provides comprehensive nanoimprint solutions and operates a precision molding division that produces dies and plastic components through an integrated design-to-manufacture process.

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Date Filing Language Size Actions
2025-08-08 08:45
Report Publication Announcement
確認書
Japanese 8.0 KB
2025-08-08 08:44
Interim Report
半期報告書-第54期(2025/01/01-2025/12/31)
Japanese 467.9 KB
2025-05-01 02:24
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 22.5 KB
2025-05-01 02:24
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 23.7 KB
2025-03-27 07:37
Post-Annual General Meeting Information
臨時報告書
Japanese 22.6 KB
2025-03-27 07:37
Registration Form
確認書
Japanese 8.0 KB
2025-03-27 07:36
Governance Information
内部統制報告書-第53期(2024/01/01-2024/12/31)
Japanese 21.8 KB
2025-03-27 07:34
Annual Report
有価証券報告書-第53期(2024/01/01-2024/12/31)
Japanese 1.2 MB
2024-08-09 09:36
Interim Report
半期報告書-第53期(2024/01/01-2024/12/31)
Japanese 477.9 KB
2024-08-09 09:36
Regulatory News Service
確認書
Japanese 8.0 KB
2024-05-14 08:35
Report Publication Announcement
確認書
Japanese 8.0 KB
2024-05-14 08:34
Quarterly Report
四半期報告書-第53期第1四半期(2024/01/01-2024/03/31)
Japanese 444.0 KB
2024-03-29 05:30
Post-Annual General Meeting Information
臨時報告書
Japanese 23.6 KB
2024-03-28 07:37
Governance Information
内部統制報告書-第52期(2023/01/01-2023/12/31)
Japanese 21.6 KB
2024-03-28 07:36
Annual Report
有価証券報告書-第52期(2023/01/01-2023/12/31)
Japanese 1.3 MB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

Peer Companies

Company Country Ticker View
DISCO CORPORATION Logo
Precision cutting, grinding & polishing equipment for the semiconductor and electronics industries.
Japan 6146
DIT Corp. Logo
Develops AI-powered inspection equipment for semiconductor & flat-panel display manufacturing.
South Korea 110990
Doosan Robotics Inc. Logo
Manufactures AI-powered collaborative robots (cobots) for manufacturing, logistics, and services.
South Korea 454910
Dürr AG Logo
Automated plant engineering & robotics for efficient automotive & industrial manufacturing.
Germany DUE
Global manufacturer of precision tire molds and manufacturing equipment for the tire industry.
South Korea 145210
Air pollution control tech reducing greenhouse gases for the semiconductor industry.
South Korea 383310
Develops water-free robotic cleaning solutions for utility-scale solar sites.
Israel ECPA-M
Eles Logo
Provides reliability test solutions for zero-defect semiconductors in mission-critical sectors.
Italy ELES
ENBIOCO., LTD. Logo
Develops self-contained wastewater recycling systems for homes, agriculture, and industry.
South Korea 352940
ENJET Co.,LTD Logo
EHD inkjet printers for high-res patterning in displays, semiconductors, & camera modules.
South Korea 419080

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