TA

Takatori Corporation

Makes high-precision machinery for semiconductors, LCDs, and advanced material processing.

6338 | T

Overview

Corporate Details

ISIN(s):
N/A
LEI:
Country:
Japan
Address:
橿原市新堂町313番地の1
Sector:
Manufacturing
Industry:
Manufacture of special-purpose machinery

Description

Takatori Corporation is a manufacturer engaged in the development, production, and sale of high-precision machinery and equipment. The company's primary product lines serve the electronics sector, including semiconductor manufacturing equipment and machinery for producing liquid crystal display (LCD) panels. It is also a key provider of advanced material processing systems, notably multi-wire saws for precision slicing. Leveraging its core technological expertise, Takatori has diversified its operations to include textile equipment, medical devices, and components for the space industry, such as casings for microsatellites. The company focuses on innovation to meet the evolving demands of various advanced technology sectors.

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Date Filing Language Size Actions
2025-09-10 08:35
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 22.0 KB
2025-08-29 09:58
Transaction in Own Shares
訂正自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 24.1 KB
2025-08-12 07:39
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 21.4 KB
2025-05-13 08:34
Interim Report
半期報告書-第69期(2024/10/01-2025/09/30)
Japanese 181.6 KB
2025-05-13 08:34
Regulatory News Service
確認書
Japanese 8.0 KB
2024-12-24 08:04
Regulatory News Service
臨時報告書
Japanese 24.5 KB
2024-12-23 07:34
Registration Form
確認書
Japanese 8.0 KB
2024-12-23 07:33
Governance Information
内部統制報告書-第68期(2023/10/01-2024/09/30)
Japanese 21.5 KB
2024-12-23 07:32
Annual Report
有価証券報告書-第68期(2023/10/01-2024/09/30)
Japanese 962.3 KB
2024-05-14 08:04
Regulatory News Service
確認書
Japanese 7.9 KB
2024-05-14 08:03
Quarterly Report
四半期報告書-第68期第2四半期(2024/01/01-2024/03/31)
Japanese 180.5 KB
2024-02-09 07:34
Regulatory News Service
確認書
Japanese 8.0 KB
2024-02-09 07:33
Quarterly Report
四半期報告書-第68期第1四半期(2023/10/01-2023/12/31)
Japanese 154.0 KB
2023-12-26 07:36
Post-Annual General Meeting Information
臨時報告書
Japanese 20.6 KB
2023-12-25 08:04
Regulatory News Service
確認書
Japanese 8.0 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

Peer Companies

Company Country Ticker View
DISCO CORPORATION Logo
Precision cutting, grinding & polishing equipment for the semiconductor and electronics industries.
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DIT Corp. Logo
Develops AI-powered inspection equipment for semiconductor & flat-panel display manufacturing.
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Doosan Robotics Inc. Logo
Manufactures AI-powered collaborative robots (cobots) for manufacturing, logistics, and services.
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Dürr AG Logo
Automated plant engineering & robotics for efficient automotive & industrial manufacturing.
Germany DUE
Global manufacturer of precision tire molds and manufacturing equipment for the tire industry.
South Korea 145210
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South Korea 383310
Develops water-free robotic cleaning solutions for utility-scale solar sites.
Israel ECPA-M
Eles Logo
Provides reliability test solutions for zero-defect semiconductors in mission-critical sectors.
Italy ELES
ENBIOCO., LTD. Logo
Develops self-contained wastewater recycling systems for homes, agriculture, and industry.
South Korea 352940
ENJET Co.,LTD Logo
EHD inkjet printers for high-res patterning in displays, semiconductors, & camera modules.
South Korea 419080

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