SAMCO INC.
Manufactures semiconductor processing equipment for thin-film deposition, etching & surface treatment.
6387 | T
Overview
Corporate Details
- ISIN(s):
- JP3322950001
- LEI:
- Country:
- Japan
- Address:
- 京都市伏見区竹田藁屋町３６番地
- Website:
- https://www.samco.co.jp/en/
- Sector:
- Manufacturing
- Industry:
- Manufacture of special-purpose machinery
Description
Samco Inc. is a manufacturer of semiconductor and electronic component processing equipment for both research and development (R&D) and production environments. The company specializes in thin-film deposition, etching, and surface treatment technologies. Its core product lines include systems for Plasma-Enhanced Chemical Vapor Deposition (PECVD), Atomic Layer Deposition (ALD), Inductively Coupled Plasma (ICP) etching, and Deep Reactive Ion Etching (DRIE). Samco also provides surface treatment solutions such as proprietary Aqua Plasma®, plasma, and UV-Ozone cleaners. The company's equipment is used in the fabrication of advanced devices, including MicroLEDs, laser diodes, VCSELs, SiC power devices, GaN RF devices, and BAW/SAW filters.
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Filings
| Date | Filing | Language | Size | Actions | |
|---|---|---|---|---|---|
| 2025-10-20 04:24 |
Registration Form
確認書
|
Japanese | 8.0 KB | ||
| 2025-10-20 04:22 |
Annual Report
有価証券報告書－第46期(2024/08/01－2025/07/31)
|
Japanese | 839.2 KB | ||
| 2025-03-13 01:15 |
Regulatory News Service
確認書
|
Japanese | 8.0 KB | ||
| 2025-03-13 01:14 |
Interim Report
半期報告書－第46期(2024/08/01－2025/07/31)
|
Japanese | 193.2 KB | ||
| 2024-10-24 04:57 |
Post-Annual General Meeting Information
臨時報告書
|
Japanese | 27.4 KB | ||
| 2024-10-22 09:43 |
Regulatory News Service
確認書
|
Japanese | 8.0 KB | ||
| 2024-10-22 09:41 |
Regulatory News Service
内部統制報告書－第45期(2023/08/01－2024/07/31)
|
Japanese | 21.4 KB | ||
| 2024-10-22 09:39 |
Annual Report
有価証券報告書－第45期(2023/08/01－2024/07/31)
|
Japanese | 825.2 KB | ||
| 2024-06-10 02:20 |
Report Publication Announcement
確認書
|
Japanese | 8.0 KB | ||
| 2024-06-10 02:19 |
Quarterly Report
四半期報告書－第45期第3四半期(2024/02/01－2024/04/30)
|
Japanese | 155.6 KB | ||
| 2024-03-14 01:19 |
Report Publication Announcement
確認書
|
Japanese | 8.0 KB | ||
| 2024-03-14 01:18 |
Quarterly Report
四半期報告書－第45期第2四半期(2023/11/01－2024/01/31)
|
Japanese | 190.9 KB | ||
| 2023-12-12 01:14 |
Report Publication Announcement
確認書
|
Japanese | 8.0 KB | ||
| 2023-12-12 01:13 |
Quarterly Report
四半期報告書－第45期第1四半期(2023/08/01－2023/10/31)
|
Japanese | 153.1 KB | ||
| 2023-10-26 03:22 |
Regulatory News Service
臨時報告書
|
Japanese | 21.3 KB |
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Market Data
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Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
