SAMCO INC.
Manufacturer of process equipment for the semiconductor and electronic device industries.
6387 | T
Overview
Corporate Details
- ISIN(s):
- JP3322950001
- LEI:
- Country:
- Japan
- Address:
- 京都市伏見区竹田藁屋町３６番地
- Website:
- https://www.samco.co.jp/en/
- Sector:
- Manufacturing
- Industry:
- Manufacture of special-purpose machinery
Description
SAMCO INC. is a manufacturer of process equipment for the semiconductor and electronic device industries, serving both research and development (R&D) and production applications. The company specializes in thin-film deposition, microfabrication etching, and surface treatment technologies. Its product portfolio includes systems for Atomic Layer Deposition (ALD) and Plasma-Enhanced Chemical Vapor Deposition (PECVD). Etching solutions feature Atomic Layer Etching (ALE), Inductively Coupled Plasma (ICP) etching, and Deep Reactive Ion Etching (DRIE). The company also provides surface treatment equipment, such as plasma cleaning and UV ozone cleaning systems.
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Filings
| Date | Filing | Language | Size | Actions | |
|---|---|---|---|---|---|
| 2025-10-20 04:24 |
確認書
|
Japanese | 8.0 KB | ||
| 2025-10-20 04:22 |
有価証券報告書－第46期(2024/08/01－2025/07/31)
|
Japanese | 839.2 KB | ||
| 2025-03-13 01:15 |
確認書
|
Japanese | 8.0 KB | ||
| 2025-03-13 01:14 |
半期報告書－第46期(2024/08/01－2025/07/31)
|
Japanese | 193.2 KB | ||
| 2024-10-24 04:57 |
臨時報告書
|
Japanese | 27.4 KB | ||
| 2024-10-22 09:43 |
確認書
|
Japanese | 8.0 KB | ||
| 2024-10-22 09:41 |
内部統制報告書－第45期(2023/08/01－2024/07/31)
|
Japanese | 21.4 KB | ||
| 2024-10-22 09:39 |
有価証券報告書－第45期(2023/08/01－2024/07/31)
|
Japanese | 825.2 KB | ||
| 2024-06-10 02:20 |
確認書
|
Japanese | 8.0 KB | ||
| 2024-06-10 02:19 |
四半期報告書－第45期第3四半期(2024/02/01－2024/04/30)
|
Japanese | 155.6 KB | ||
| 2024-03-14 01:19 |
確認書
|
Japanese | 8.0 KB | ||
| 2024-03-14 01:18 |
四半期報告書－第45期第2四半期(2023/11/01－2024/01/31)
|
Japanese | 190.9 KB | ||
| 2023-12-12 01:14 |
確認書
|
Japanese | 8.0 KB | ||
| 2023-12-12 01:13 |
四半期報告書－第45期第1四半期(2023/08/01－2023/10/31)
|
Japanese | 153.1 KB | ||
| 2023-10-26 03:22 |
臨時報告書
|
Japanese | 21.3 KB |
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Market Data
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Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
