HPSP Co., Ltd. Logo

HPSP Co., Ltd.

Provides high-pressure annealing systems for advanced semiconductor manufacturing.

403870 | KO

Overview

Corporate Details

ISIN(s):
KR7403870009
LEI:
Country:
South Korea
Address:
경기도 화성시 삼성1로1길 26 석우동, 화성시
Sector:
Manufacturing
Industry:
Manufacture of special-purpose machinery

Description

HPSP Co., Ltd. is a global semiconductor equipment company specializing in the development, manufacturing, and servicing of high-pressure hydrogen annealing systems. Its proprietary High Pressure Anneal Process (HPAP) technology is a critical component in the production of cutting-edge semiconductors, providing atomic-scale precision control for ultra-fine manufacturing processes. The company's equipment is utilized by leading global semiconductor manufacturers to produce the advanced chips found in electronics such as smartphones, computers, and smart cars. HPSP also offers dedicated customer support to maximize productivity, improve throughput, and optimize system uptime for its clients.

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Date Filing Language Size Actions
2025-09-18 00:00
임시주주총회결과
Korean 7.8 KB
2025-09-18 00:00
자기주식처분결과보고서
Korean 17.1 KB
2025-09-12 00:00
[기재정정]주주총회소집공고
Korean 56.0 KB
2025-09-12 00:00
[기재정정]주주총회소집공고
Korean 56.0 KB
2025-09-12 00:00
[기재정정]의결권대리행사권유참고서류
Korean 46.9 KB
2025-09-03 00:00
주주총회소집공고
Korean 51.0 KB
2025-09-03 00:00
의결권대리행사권유참고서류
Korean 41.8 KB
2025-08-14 00:00
반기보고서 (2025.06)
Korean 925.5 KB
2025-08-07 00:00
[기재정정]주식매수선택권부여에관한신고
Korean 25.7 KB
2025-08-07 00:00
주주총회소집결의 (임시주주총회)
Korean 8.5 KB
2025-08-07 00:00
주주명부폐쇄기간또는기준일설정
Korean 4.7 KB
2025-07-03 00:00
주식등의대량보유상황보고서(약식)
Korean 66.2 KB
2025-07-02 00:00
임원ㆍ주요주주특정증권등소유상황보고서
Korean 25.0 KB
2025-07-02 00:00
임원ㆍ주요주주특정증권등소유상황보고서
Korean 24.3 KB
2025-05-19 00:00
주식등의대량보유상황보고서(일반)
Korean 86.5 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

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