HOSOKAWA  MICRON  CORPORATION Logo

HOSOKAWA MICRON CORPORATION

Provider of powder processing systems for pharma, food, chemical, and advanced materials.

6277 | T

Overview

Corporate Details

ISIN(s):
N/A
LEI:
Country:
Japan
Address:
枚方市招提田近1丁目9番地
Sector:
Manufacturing
Industry:
Manufacture of special-purpose machinery

Description

Founded in 1916, Hosokawa Micron Corporation is a global leader specializing in powder and particle processing technology. The company develops, manufactures, and sells a comprehensive range of process equipment and systems for mechanical and thermal processing, including grinding, classification, mixing, drying, containment, and compaction. It also provides engineering and maintenance services for its powder-related systems. Hosokawa Micron's technologies are integral to manufacturing processes across diverse industries, such as pharmaceuticals, food, chemicals, cosmetics, and advanced materials for applications like lithium-ion batteries, electronics, and eco-friendly vehicles. The group focuses on advancing powder technology to help customers create particles for advanced formulations.

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Filings

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Date Filing Language Size Actions
2025-10-10 02:17
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 25.5 KB
2025-09-11 02:18
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 25.4 KB
2025-05-13 02:27
Interim Report
確認書
Japanese 9.7 KB
2025-05-13 02:26
Interim Report
半期報告書-第81期(2024/10/01-2025/09/30)
Japanese 263.7 KB
2024-12-20 07:46
Post-Annual General Meeting Information
臨時報告書
Japanese 27.0 KB
2024-12-18 02:20
Governance Information
内部統制報告書-第80期(2023/10/01-2024/09/30)
Japanese 24.5 KB
2024-12-18 02:13
Registration Form
確認書
Japanese 9.7 KB
2024-12-18 02:11
Annual Report
有価証券報告書-第80期(2023/10/01-2024/09/30)
Japanese 1.7 MB
2024-10-11 07:38
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 25.5 KB
2024-09-12 06:38
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 25.1 KB
2024-05-10 08:26
Quarterly Report
確認書
Japanese 9.5 KB
2024-05-10 08:24
Quarterly Report
四半期報告書-第80期第2四半期(2024/01/01-2024/03/31)
Japanese 252.7 KB
2024-02-09 07:12
Report Publication Announcement
確認書
Japanese 9.5 KB
2024-02-09 07:11
Quarterly Report
四半期報告書-第80期第1四半期(2023/10/01-2023/12/31)
Japanese 193.6 KB
2023-12-19 03:24
Post-Annual General Meeting Information
臨時報告書
Japanese 27.1 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

Peer Companies

Company Country Ticker View
DISCO CORPORATION Logo
Precision cutting, grinding & polishing equipment for the semiconductor and electronics industries.
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Develops AI-powered inspection equipment for semiconductor & flat-panel display manufacturing.
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Manufactures AI-powered collaborative robots (cobots) for manufacturing, logistics, and services.
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Dürr AG Logo
Automated plant engineering & robotics for efficient automotive & industrial manufacturing.
Germany DUE
Global manufacturer of precision tire molds and manufacturing equipment for the tire industry.
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South Korea 383310
Develops water-free robotic cleaning solutions for utility-scale solar sites.
Israel ECPA-M
Eles Logo
Provides reliability test solutions for zero-defect semiconductors in mission-critical sectors.
Italy ELES
ENBIOCO., LTD. Logo
Develops self-contained wastewater recycling systems for homes, agriculture, and industry.
South Korea 352940
ENJET Co.,LTD Logo
EHD inkjet printers for high-res patterning in displays, semiconductors, & camera modules.
South Korea 419080

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