HOSOKAWA  MICRON  CORPORATION Logo

HOSOKAWA MICRON CORPORATION

Provider of powder processing systems for pharma, food, chemical, and advanced materials.

6277 | T

Overview

Corporate Details

ISIN(s):
JP3846000002
LEI:
Country:
Japan
Address:
枚方市招提田近1丁目9番地
Sector:
Manufacturing
Industry:
Manufacture of special-purpose machinery

Description

Founded in 1916, Hosokawa Micron Corporation is a global leader specializing in powder and particle processing technology. The company develops, manufactures, and sells a comprehensive range of process equipment and systems for mechanical and thermal processing, including grinding, classification, mixing, drying, containment, and compaction. It also provides engineering and maintenance services for its powder-related systems. Hosokawa Micron's technologies are integral to manufacturing processes across diverse industries, such as pharmaceuticals, food, chemicals, cosmetics, and advanced materials for applications like lithium-ion batteries, electronics, and eco-friendly vehicles. The group focuses on advancing powder technology to help customers create particles for advanced formulations.

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Filings

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Date Filing Language Size Actions
2025-10-10 02:17
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 25.5 KB
2025-09-11 02:18
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 25.4 KB
2025-05-13 02:27
Interim Report
確認書
Japanese 9.7 KB
2025-05-13 02:26
Interim Report
半期報告書-第81期(2024/10/01-2025/09/30)
Japanese 263.7 KB
2024-12-20 07:46
Post-Annual General Meeting Information
臨時報告書
Japanese 27.0 KB
2024-12-18 02:20
Governance Information
内部統制報告書-第80期(2023/10/01-2024/09/30)
Japanese 24.5 KB
2024-12-18 02:13
Registration Form
確認書
Japanese 9.7 KB
2024-12-18 02:11
Annual Report
有価証券報告書-第80期(2023/10/01-2024/09/30)
Japanese 1.7 MB
2024-10-11 07:38
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 25.5 KB
2024-09-12 06:38
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 25.1 KB
2024-05-10 08:26
Quarterly Report
確認書
Japanese 9.5 KB
2024-05-10 08:24
Quarterly Report
四半期報告書-第80期第2四半期(2024/01/01-2024/03/31)
Japanese 252.7 KB
2024-02-09 07:12
Report Publication Announcement
確認書
Japanese 9.5 KB
2024-02-09 07:11
Quarterly Report
四半期報告書-第80期第1四半期(2023/10/01-2023/12/31)
Japanese 193.6 KB
2023-12-19 03:24
Post-Annual General Meeting Information
臨時報告書
Japanese 27.1 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

Peer Companies

Company Country Ticker View
TESEC Corporation Logo
Manufactures automated testers and handlers for power, semiconductor, and MEMS devices worldwide.
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TOKYO AUTOMATIC MACHINERY WORKS, LTD Logo
An integrated maker of automated packaging, wrapping, and solid waste baling machines.
Japan 6360
Tokyo Electron Limited Logo
Leading global supplier of semiconductor and flat panel display production equipment.
Japan 8035
TOKYO KIKAI SEISAKUSHO,LTD. Logo
A leading manufacturer of printing presses and automated systems, including AGVs.
Japan 6335
Manufacturer of semiconductor production equipment and precision measuring instruments for high-tech industries.
Japan 7729
TOMRA Systems Logo
Sensor-based sorting & collection systems for food, recycling, and mining to enable a circular economy.
Norway TOM
Top Engineering Company Limited Logo
Manufacturer of LCD production equipment and services for the display industry.
South Korea 065130
Specializes in factory automation for EV batteries, logistics (AGVs), and smart factory solutions.
South Korea 108230

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