Hosiden Corporation Logo

Hosiden Corporation

Manufactures components like connectors & sensors for auto, IoT, mobile & AV applications.

6804 | T

Overview

Corporate Details

ISIN(s):
JP3845800006
LEI:
Country:
Japan
Address:
八尾市北久宝寺1丁目4番33号
Sector:
Manufacturing
Industry:
Manufacture of electronic components and boards

Description

Hosiden Corporation is a global manufacturer of electronic components, providing one-stop ODM, OEM, and EMS solutions. The company's diverse product portfolio includes connecting components such as connectors and switches; transducers like microphones, speakers, receivers, and touch sensors; and wireless products, including Bluetooth® modules. Hosiden serves a wide range of high-tech markets, supplying essential parts for applications in the automotive, IoT, home & mobile, and audio/visual (AV) sectors. The company focuses on contributing to the increasing sophistication and functionality of modern electronic devices through its high-performance components and customized product solutions.

Unlock This Filing & Millions More

You're one step away from the data you need. Create a free account to instantly view this filing and get access to powerful research tools.

Filings

You have of free filing views remaining. Upgrade for unlimited access.
Quick Filters:

Filters

Clear
Bulk Actions:
Date Filing Language Size Actions
2025-11-13 07:42
Registration Form
確認書
Japanese 8.2 KB
2025-11-13 07:42
Interim Report
半期報告書-第76期(2025/04/01-2026/03/31)
Japanese 194.8 KB
2025-07-04 09:31
Post-Annual General Meeting Information
臨時報告書
Japanese 28.9 KB
2025-06-25 08:49
Governance Information
内部統制報告書-第75期(2024/04/01-2025/03/31)
Japanese 23.3 KB
2025-06-25 08:48
Registration Form
確認書
Japanese 8.2 KB
2025-06-25 08:47
Annual Report
有価証券報告書-第75期(2024/04/01-2025/03/31)
Japanese 1.2 MB
2025-02-14 02:20
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 22.5 KB
2025-01-10 06:35
Transaction in Own Shares
自己株券買付状況報告書(法24条の6第1項に基づくもの)
Japanese 25.3 KB
2024-12-04 02:46
Share Issue/Capital Change
訂正臨時報告書
Japanese 51.7 KB
2024-12-03 08:14
Share Issue/Capital Change
臨時報告書
Japanese 77.1 KB
2024-11-13 02:06
Report Publication Announcement
確認書
Japanese 8.2 KB
2024-11-13 01:59
Interim Report
半期報告書-第75期(2024/04/01-2025/03/31)
Japanese 184.9 KB
2024-07-29 03:47
Registration Form
確認書
Japanese 8.3 KB
2024-07-29 03:28
Annual Report
訂正有価証券報告書-第74期(2023/04/01-2024/03/31)
Japanese 666.2 KB
2024-07-04 09:50
Regulatory News Service
臨時報告書
Japanese 27.8 KB

Automate Your Workflow. Get a real-time feed of all Hosiden Corporation filings delivered via API.

Explore Data Feeds →

Market Data

Market Data Not Available

Financials & KPIs

No data available

Unlock Full Financials for Hosiden Corporation

This data is available as part of our premium data solutions. Contact our team for access.

Need More History? Access decades of standardized financials for Hosiden Corporation via our API.

Get Historical Data →

Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

Peer Companies

ASE Technology Holding Co., Ltd. Logo
Global provider of outsourced semiconductor assembly, testing (OSAT) & manufacturing services.
United States of America
ASX
Aspocomp Group Oyj Logo
Supplies advanced high-tech PCBs and lifecycle services to the global electronics industry.
Finland
ACG1V
Astera Labs, Inc. Logo
Purpose-built connectivity solutions removing bottlenecks in AI and cloud infrastructure.
United States of America
ALAB
Manufactures non-memory semiconductors and optoelectronic devices for global electronic applications.
South Korea
017900
One-stop solutions for custom PCB & PCBA manufacturing, with a focus on automotive electronics.
South Korea
015260
Manufactures advanced MLCCs for high-growth industries like automotive, 5G, AI, and IoT.
South Korea
149950
AXELL CORPORATION Logo
A fabless designer of LSI and IC semiconductor products with expertise in graphics technologies.
Japan
6730
AXT INC Logo
Manufactures advanced semiconductor substrates for telecom, data centers, and industrial applications.
United States of America
AXTI
BCnC Co., Ltd. Logo
Manufactures advanced material parts for the semiconductor, display, and solar industries.
South Korea
146320
BeammWave AB Logo
Develops single-chip digital beamforming RFICs for 5G/6G mmWave communication.
Sweden
BEAMMW

Talk to a Data Expert

Have a question? We'll get back to you promptly.