Hansol Technics Co., Ltd
004710 | KO
Overview
Corporate Details
- ISIN(s):
- KR7004710000
- LEI:
- Country:
- South Korea
- Address:
- 서울특별시 중구 을지로 100, 중구
- Website:
- https://www.hansoltechnics.com/
- Sector:
- Manufacturing
- Industry:
- Manufacture of electronic components and boards
Description
No description available.
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Filings
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Bulk Actions:
| Date | Filing | Language | Size | Actions | |
|---|---|---|---|---|---|
| 2025-08-27 00:00 |
Related Party Transaction
대규모기업집단현황공시[분기별공시(개별회사용)]
|
Korean | 12.0 KB | ||
| 2025-08-13 00:00 |
Regulatory Filings
지급수단별ㆍ지급기간별지급금액및분쟁조정기구에관한사항
|
Korean | 11.6 KB | ||
| 2025-08-13 00:00 |
Interim / Quarterly Report
반기보고서 (2025.06)
|
Korean | 4.8 MB | ||
| 2025-08-01 00:00 |
AGM Information
임시주주총회결과
|
Korean | 7.6 KB | ||
| 2025-07-18 00:00 |
Earnings Release
연결재무제표기준영업(잠정)실적(공정공시)
|
Korean | 15.0 KB | ||
| 2025-07-15 00:00 |
Pre-Annual General Meeting Information
[기재정정]주주총회소집결의
|
Korean | 14.8 KB | ||
| 2025-07-15 00:00 |
Pre-Annual General Meeting Information
주주총회소집공고
|
Korean | 87.0 KB | ||
| 2025-07-15 00:00 |
Proxy Solicitation & Information Statement
의결권대리행사권유참고서류
|
Korean | 70.2 KB | ||
| 2025-06-20 00:00 |
Delisting Announcement
매매거래정지및정지해제(중요내용공시)
|
Korean | 5.1 KB | ||
| 2025-06-20 00:00 |
Share Issue/Capital Change
주요사항보고서(감자결정)
|
Korean | 16.3 KB | ||
| 2025-06-20 00:00 |
M&A Activity
타법인주식및출자증권취득결정
|
Korean | 18.5 KB | ||
| 2025-06-20 00:00 |
Pre-Annual General Meeting Information
주주명부폐쇄기간또는기준일설정
|
Korean | 4.1 KB | ||
| 2025-06-20 00:00 |
Pre-Annual General Meeting Information
주주총회소집결의
|
Korean | 9.8 KB | ||
| 2025-06-02 00:00 |
Governance Information
기업지배구조보고서공시
|
Korean | 1.4 MB | ||
| 2025-05-29 00:00 |
Major Shareholding Notification
대규모기업집단현황공시[연1회공시및1/4분기용(개별회사)]
|
Korean | 141.8 KB |
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Market Data
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Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
Company
Country
Ticker
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Designs & makes interconnect, sensor & antenna solutions for automotive, aerospace, IT & mobile markets.
United States of America
APH
United States of America
APH
Designs optical solutions like LEDs and sensors for automotive, medical, and industrial markets.
Austria
AMS
Austria
AMS
Designs high-performance analog and mixed-signal ICs for industrial, auto, and comms markets.
United States of America
ADI
United States of America
ADI
Fabless chip designer of TCONs and SoCs for the global high-resolution display market.
South Korea
123860
South Korea
123860
Provider of outsourced semiconductor packaging and testing (OSAT) for various electronic components.
Japan
6832
Japan
6832
Back-end semiconductor services, including packaging, testing, and inspection equipment.
South Korea
200470
South Korea
200470
Global provider of outsourced semiconductor assembly, testing (OSAT) & manufacturing services.
United States of America
ASX
United States of America
ASX
Supplies advanced high-tech PCBs and lifecycle services to the global electronics industry.
Finland
ACG1V
Finland
ACG1V
Manufactures sanitation products, complex molded parts, and protective semiconductor materials.
Japan
4241
Japan
4241
Manufactures high-end PCBs and IC substrates for mobile, auto, industrial, and medical devices.
Austria
ATS
Austria
ATS