HANMI Semiconductor CO., LTD.
Manufactures back-end semiconductor equipment, including TC Bonders for HBM and AI applications.
042700 | KO
Overview
Corporate Details
- ISIN(s):
- N/A
- LEI:
- Country:
- South Korea
- Address:
- 인천광역시 서구 가좌로30번길 14, 인천광역시
- Website:
- https://www.hanmisemi.com
- Sector:
- Manufacturing
- Industry:
- Manufacture of special-purpose machinery
Description
Established in 1980, HANMI Semiconductor is a global manufacturer of semiconductor production equipment, specializing in back-end processing solutions. The company's extensive product portfolio includes high-precision Vision Placement systems, micro SAW equipment for wafer dicing, EMI shielding solutions, and advanced bonding systems. HANMI is particularly recognized as a market leader for its Thermal Compression (TC) Bonders, which are critical for manufacturing High Bandwidth Memory (HBM) used in AI accelerators and high-performance computing applications. Through continuous research and development, the company provides essential technology to a global network of leading semiconductor manufacturers, enabling the advancement of next-generation chip packaging.
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Filings
| Date | Filing | Language | Size | Actions | |
|---|---|---|---|---|---|
| 2025-09-17 00:00 |
Post-Annual General Meeting Information
임시주주총회결과
|
Korean | 10.6 KB | ||
| 2025-09-09 00:00 |
Report Publication Announcement
기업설명회(IR)개최(안내공시)
|
Korean | 6.8 KB | ||
| 2025-09-09 00:00 |
Report Publication Announcement
기업설명회(IR)개최(안내공시)
|
Korean | 6.4 KB | ||
| 2025-09-09 00:00 |
Report Publication Announcement
기업설명회(IR)개최(안내공시)
|
Korean | 6.4 KB | ||
| 2025-09-02 00:00 |
Pre-Annual General Meeting Information
주주총회소집공고
|
Korean | 41.2 KB | ||
| 2025-09-01 00:00 |
Report Publication Announcement
기업설명회(IR)개최(안내공시)
|
Korean | 6.5 KB | ||
| 2025-08-20 00:00 |
Report Publication Announcement
기업설명회(IR)개최(안내공시)
|
Korean | 6.2 KB | ||
| 2025-08-20 00:00 |
Report Publication Announcement
기업설명회(IR)개최(안내공시)
|
Korean | 6.1 KB | ||
| 2025-08-14 00:00 |
Interim Report
반기보고서 (2025.06)
|
Korean | 4.1 MB | ||
| 2025-08-06 00:00 |
Pre-Annual General Meeting Information
주주총회소집결의
|
Korean | 10.8 KB | ||
| 2025-08-06 00:00 |
Pre-Annual General Meeting Information
주주명부폐쇄기간또는기준일설정
|
Korean | 4.1 KB | ||
| 2025-07-28 00:00 |
Report Publication Announcement
기업설명회(IR)개최(안내공시)
|
Korean | 6.2 KB | ||
| 2025-07-25 00:00 |
Earnings Release
연결재무제표기준영업(잠정)실적(공정공시)
|
Korean | 15.2 KB | ||
| 2025-07-21 00:00 |
Report Publication Announcement
기업설명회(IR)개최(안내공시)
|
Korean | 6.8 KB | ||
| 2025-07-03 00:00 |
Report Publication Announcement
기업설명회(IR)개최(안내공시)
|
Korean | 6.3 KB |
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Market Data
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Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
