HANMI Semiconductor CO., LTD. Logo

HANMI Semiconductor CO., LTD.

Manufactures back-end semiconductor equipment, including TC Bonders for HBM and AI applications.

042700 | KO

Overview

Corporate Details

ISIN(s):
KR7042700005
LEI:
Country:
South Korea
Address:
인천광역시 서구 가좌로30번길 14, 인천광역시
Sector:
Manufacturing
Industry:
Manufacture of special-purpose machinery

Description

Established in 1980, HANMI Semiconductor is a global manufacturer of semiconductor production equipment, specializing in back-end processing solutions. The company's extensive product portfolio includes high-precision Vision Placement systems, micro SAW equipment for wafer dicing, EMI shielding solutions, and advanced bonding systems. HANMI is particularly recognized as a market leader for its Thermal Compression (TC) Bonders, which are critical for manufacturing High Bandwidth Memory (HBM) used in AI accelerators and high-performance computing applications. Through continuous research and development, the company provides essential technology to a global network of leading semiconductor manufacturers, enabling the advancement of next-generation chip packaging.

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Filings

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Date Filing Language Size Actions
2025-09-17 00:00
임시주주총회결과
Korean 10.6 KB
2025-09-09 00:00
기업설명회(IR)개최(안내공시)
Korean 6.8 KB
2025-09-09 00:00
기업설명회(IR)개최(안내공시)
Korean 6.4 KB
2025-09-09 00:00
기업설명회(IR)개최(안내공시)
Korean 6.4 KB
2025-09-02 00:00
주주총회소집공고
Korean 41.2 KB
2025-09-01 00:00
기업설명회(IR)개최(안내공시)
Korean 6.5 KB
2025-08-20 00:00
기업설명회(IR)개최(안내공시)
Korean 6.2 KB
2025-08-20 00:00
기업설명회(IR)개최(안내공시)
Korean 6.1 KB
2025-08-14 00:00
반기보고서 (2025.06)
Korean 4.1 MB
2025-08-06 00:00
주주총회소집결의
Korean 10.8 KB
2025-08-06 00:00
주주명부폐쇄기간또는기준일설정
Korean 4.1 KB
2025-07-28 00:00
기업설명회(IR)개최(안내공시)
Korean 6.2 KB
2025-07-25 00:00
연결재무제표기준영업(잠정)실적(공정공시)
Korean 15.2 KB
2025-07-21 00:00
기업설명회(IR)개최(안내공시)
Korean 6.8 KB
2025-07-03 00:00
기업설명회(IR)개최(안내공시)
Korean 6.3 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

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