DISCO CORPORATION Logo

DISCO CORPORATION

Precision cutting, grinding & polishing equipment for the semiconductor and electronics industries.

6146 | T

Overview

Corporate Details

ISIN(s):
N/A
LEI:
Country:
Japan
Address:
大田区大森北二丁目13番11号
Sector:
Manufacturing
Industry:
Manufacture of special-purpose machinery

Description

DISCO Corporation is a leading manufacturer of precision processing equipment and tools for the semiconductor and electronics industries. The company's core competency is its advanced 'Kiru, Kezuru, Migaku' (cutting, grinding, polishing) technologies. Its product portfolio includes dicing saws, laser saws, grinders, and polishers essential for processing semiconductor wafers and other electronic materials. In addition to equipment sales, DISCO provides comprehensive solutions, including application support with test cuts, dicing and grinding services for prototyping and low-volume production, and customer training for equipment operation and maintenance.

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Date Filing Language Size Actions
2025-08-01 08:30
Share Issue/Capital Change
訂正臨時報告書
Japanese 53.1 KB
2025-07-17 09:00
Share Issue/Capital Change
臨時報告書
Japanese 55.6 KB
2025-07-17 09:00
Share Issue/Capital Change
臨時報告書
Japanese 30.9 KB
2025-06-25 02:53
Post-Annual General Meeting Information
臨時報告書
Japanese 24.4 KB
2025-06-24 09:35
Regulatory News Service
内部統制報告書-第86期(2024/04/01-2025/03/31)
Japanese 22.6 KB
2025-06-24 09:34
Regulatory News Service
確認書
Japanese 8.2 KB
2025-06-24 09:33
Annual Report
有価証券報告書-第86期(2024/04/01-2025/03/31)
Japanese 2.1 MB
2024-10-31 07:58
Report Publication Announcement
確認書
Japanese 8.5 KB
2024-10-31 07:57
Interim Report
半期報告書-第86期(2024/04/01-2025/03/31)
Japanese 170.2 KB
2024-08-02 08:00
Share Issue/Capital Change
訂正臨時報告書
Japanese 53.2 KB
2024-07-18 09:02
Share Issue/Capital Change
臨時報告書
Japanese 55.7 KB
2024-07-18 09:00
Share Issue/Capital Change
臨時報告書
Japanese 31.1 KB
2024-06-24 03:33
Post-Annual General Meeting Information
臨時報告書
Japanese 25.4 KB
2024-06-21 09:22
Registration Form
確認書
Japanese 8.2 KB
2024-06-21 09:20
Governance Information
内部統制報告書-第85期(2023/04/01-2024/03/31)
Japanese 22.3 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

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