DAEDUCK Co.,LTD Logo

DAEDUCK Co.,LTD

Manufacturer of high-performance PCBs for semiconductor packaging and network systems.

008060 | KO

Overview

Corporate Details

ISIN(s):
KR7008060006
LEI:
Country:
South Korea
Address:
경기도 안산시 단원구 강촌로 230 (목내동), 안산시

Description

DAEDUCK Co., LTD. is a manufacturer specializing in high-performance Printed Circuit Boards (PCBs). The company's core products are divided into two main categories: substrates for semiconductor packaging and boards for network systems. For the semiconductor market, it produces advanced package substrates, including Flip Chip Ball Grid Array (FCBGA) and Flip Chip Chip Scale Package (fcCSP), which are essential components for integrated circuits. In the network sector, Daeduck manufactures high-performance multilayer PCBs, often exceeding 20 layers, engineered with specialized materials for high-speed and high-frequency applications such as 5G communication infrastructure. The company focuses on developing and mass-producing cutting-edge substrate technologies to support the advancement of the global electronics landscape.

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Date Filing Language Size Actions
2023-03-07 00:00
주주총회소집결의
Korean 13.2 KB
2023-02-22 00:00
매출액또는손익구조30%(대규모법인은15%)이상변경
Korean 13.3 KB
2023-02-21 00:00
매출액또는손익구조30%(대규모법인은15%)이상변경(자회사의 주요경영사항)
Korean 12.5 KB
2023-02-21 00:00
매출액또는손익구조30%(대규모법인은15%)이상변동(자회사의 주요경영사항)
Korean 11.8 KB
2022-12-14 00:00
현금ㆍ현물배당결정(자회사의 주요경영사항)
Korean 9.5 KB
2022-12-13 00:00
현금ㆍ현물배당결정
Korean 10.6 KB
2022-12-13 00:00
현금ㆍ현물배당결정(자회사의 주요경영사항)
Korean 11.3 KB
2022-11-18 00:00
최대주주등소유주식변동신고서
Korean 44.4 KB
2022-11-18 00:00
주식등의대량보유상황보고서(일반)
Korean 102.1 KB
2022-11-14 00:00
대표이사변경(자회사의 주요경영사항)
Korean 10.9 KB
2022-11-14 00:00
분기보고서 (2022.09)
Korean 1.2 MB
2022-09-16 00:00
주식등의대량보유상황보고서(일반)
Korean 103.5 KB
2022-08-16 00:00
반기보고서 (2022.06)
Korean 1.2 MB
2022-07-05 00:00
최대주주등소유주식변동신고서
Korean 52.3 KB
2022-07-05 00:00
주식등의대량보유상황보고서(일반)
Korean 102.2 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

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