atect corporation
Manufactures sanitation products, complex molded parts, and protective semiconductor materials.
4241 | T
Overview
Corporate Details
- ISIN(s):
- JP3121300002
- LEI:
- Country:
- Japan
- Address:
- 東近江市上羽田町３２７５−１
- Website:
- https://www.atect.co.jp/en/
- Sector:
- Manufacturing
- Industry:
- Manufacture of other fabricated metal products; metalworking service activities
Description
atect corporation is a diversified manufacturing company operating through three core business segments. The Sanitation Inspection Equipment division develops, sells, and services disposable inspection and sanitation management products for the bioproduct, food, and medical supply industries, supported by expertise in bacteria culture and detection. The Powder Injection Molding (PIM) division leverages over 50 years of experience to produce complex, three-dimensional parts from metal (MIM) and ceramic (CIM) powders for various industrial applications. The Semiconductor Material business develops and manufactures patented protective products and parts, such as spacer tape, for electronic components, supporting high integration and microfabrication.
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Filings
| Date | Filing | Language | Size | Actions | |
|---|---|---|---|---|---|
| 2025-06-26 08:01 |
Regulatory News Service
内部統制報告書－第56期(2024/04/01－2025/03/31)
|
Japanese | 23.6 KB | ||
| 2025-06-26 08:00 |
Regulatory News Service
確認書
|
Japanese | 8.7 KB | ||
| 2025-06-26 08:00 |
Annual Report
有価証券報告書－第56期(2024/04/01－2025/03/31)
|
Japanese | 1.1 MB | ||
| 2025-06-26 04:58 |
Post-Annual General Meeting Information
臨時報告書
|
Japanese | 21.6 KB | ||
| 2024-11-08 07:30 |
Report Publication Announcement
確認書
|
Japanese | 8.9 KB | ||
| 2024-11-08 07:30 |
Interim Report
半期報告書－第56期(2024/04/01－2025/03/31)
|
Japanese | 228.2 KB | ||
| 2024-06-27 08:02 |
Regulatory News Service
臨時報告書
|
Japanese | 24.5 KB | ||
| 2024-06-27 08:01 |
Governance Information
内部統制報告書－第55期(2023/04/01－2024/03/31)
|
Japanese | 23.5 KB | ||
| 2024-06-27 08:00 |
Registration Form
確認書
|
Japanese | 8.7 KB | ||
| 2024-06-27 08:00 |
Registration Form
有価証券報告書－第55期(2023/04/01－2024/03/31)
|
Japanese | 971.5 KB | ||
| 2024-02-07 07:01 |
Report Publication Announcement
確認書
|
Japanese | 8.9 KB | ||
| 2024-02-07 07:00 |
Quarterly Report
四半期報告書－第55期第3四半期(2023/10/01－2023/12/31)
|
Japanese | 196.8 KB | ||
| 2023-11-08 07:01 |
Quarterly Report
確認書
|
Japanese | 8.9 KB | ||
| 2023-11-08 07:01 |
Quarterly Report
四半期報告書－第55期第2四半期(2023/07/01－2023/09/30)
|
Japanese | 226.8 KB | ||
| 2023-08-04 08:02 |
Regulatory News Service
確認書
|
Japanese | 8.9 KB |
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Market Data
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Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
