atect corporation
Manufactures PIM components, sanitation equipment, and semiconductor materials.
4241 | T
Overview
Corporate Details
- ISIN(s):
- JP3121300002
- LEI:
- Country:
- Japan
- Address:
- 東近江市上羽田町３２７５−１
- Website:
- https://www.atect.co.jp/en/
- Sector:
- Manufacturing
Description
atect corporation is a technology company engaged in three core business areas: Powder Injection Molding (PIM), Sanitation Inspection Equipment, and Semiconductor Materials. The PIM business is a leading provider of an integrated manufacturing system for complex metal and ceramic components, encompassing proprietary binder materials, mold creation, injection molding, and sintering. The Sanitation Inspection Equipment division develops, manufactures, and services disposable testing apparatus for the bio-product, foodstuff, and medical sectors, offering support in bacteria culture and detection. The Semiconductor Material business develops and produces protective materials and parts, such as spacer tape, for advanced electronic components, focusing on solutions for high integration and microfabrication backed by patented technologies.
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Filings
| Date | Filing | Language | Size | Actions | |
|---|---|---|---|---|---|
| 2025-11-14 09:01 |
確認書
|
Japanese | 8.9 KB | ||
| 2025-11-14 09:00 |
半期報告書－第57期(2025/04/01－2026/03/31)
|
Japanese | 219.4 KB | ||
| 2025-06-26 08:01 |
内部統制報告書－第56期(2024/04/01－2025/03/31)
|
Japanese | 23.6 KB | ||
| 2025-06-26 08:00 |
確認書
|
Japanese | 8.7 KB | ||
| 2025-06-26 08:00 |
有価証券報告書－第56期(2024/04/01－2025/03/31)
|
Japanese | 1.1 MB | ||
| 2025-06-26 04:58 |
臨時報告書
|
Japanese | 21.6 KB | ||
| 2024-11-08 07:30 |
確認書
|
Japanese | 8.9 KB | ||
| 2024-11-08 07:30 |
半期報告書－第56期(2024/04/01－2025/03/31)
|
Japanese | 228.2 KB | ||
| 2024-06-27 08:02 |
臨時報告書
|
Japanese | 24.5 KB | ||
| 2024-06-27 08:01 |
内部統制報告書－第55期(2023/04/01－2024/03/31)
|
Japanese | 23.5 KB | ||
| 2024-06-27 08:00 |
確認書
|
Japanese | 8.7 KB | ||
| 2024-06-27 08:00 |
有価証券報告書－第55期(2023/04/01－2024/03/31)
|
Japanese | 971.5 KB | ||
| 2024-02-07 07:01 |
確認書
|
Japanese | 8.9 KB | ||
| 2024-02-07 07:00 |
四半期報告書－第55期第3四半期(2023/10/01－2023/12/31)
|
Japanese | 196.8 KB | ||
| 2023-11-08 07:01 |
確認書
|
Japanese | 8.9 KB |
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Market Data
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Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
