AR

Arisawa Mfg. Co.,Ltd.

Manufactures advanced materials, including flexible printed circuits for IT devices and phones.

5208 | T

Overview

Corporate Details

ISIN(s):
JP3126000003
LEI:
Country:
Japan
Address:
上越市南本町1丁目5番5号
Sector:
Manufacturing
Industry:
Manufacture of electronic components and boards

Description

Arisawa Mfg. Co., Ltd. is a manufacturer specializing in the research, development, and sale of advanced materials. The company's portfolio is organized into several key segments: Electronic Materials, Display (Optoelectronic) Materials, Electrical Insulating Materials, and Industrial Structural Materials. A primary product line consists of materials for flexible printed circuits (FPCs), which are crucial components in modern IT devices such as personal computers and mobile phones. Arisawa leverages its core technological expertise in weaving, resin impregnation, and Fiber-Reinforced Plastic (FRP) molding to create its diverse product offerings.

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Date Filing Language Size Actions
2025-07-01 09:24
Post-Annual General Meeting Information
臨時報告書
Japanese 27.8 KB
2025-06-25 03:43
Governance Information
内部統制報告書-第77期(2024/04/01-2025/03/31)
Japanese 24.1 KB
2025-06-25 03:41
Regulatory News Service
確認書
Japanese 8.1 KB
2025-06-25 03:40
Annual Report
有価証券報告書-第77期(2024/04/01-2025/03/31)
Japanese 2.1 MB
2025-05-23 02:03
M&A Activity
臨時報告書
Japanese 27.0 KB
2024-11-14 01:00
Report Publication Announcement
確認書
Japanese 8.1 KB
2024-11-14 01:00
Interim Report
半期報告書-第77期(2024/04/01-2025/03/31)
Japanese 212.7 KB
2024-07-02 09:03
Post-Annual General Meeting Information
臨時報告書
Japanese 27.9 KB
2024-06-28 02:06
Major Shareholding Notification
臨時報告書
Japanese 20.2 KB
2024-06-28 02:02
Governance Information
内部統制報告書-第76期(2023/04/01-2024/03/31)
Japanese 22.1 KB
2024-06-28 02:00
Registration Form
確認書
Japanese 8.1 KB
2024-06-28 02:00
Annual Report
有価証券報告書-第76期(2023/04/01-2024/03/31)
Japanese 2.1 MB
2024-02-14 01:01
Report Publication Announcement
確認書
Japanese 8.1 KB
2024-02-14 01:00
Quarterly Report
四半期報告書-第76期第3四半期(2023/10/01-2023/12/31)
Japanese 165.7 KB
2023-11-14 01:00
Report Publication Announcement
確認書
Japanese 8.1 KB

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Insider Transactions

Date Insider Name Position Type Shares Value
No insider transactions recorded for this company.

Peer Companies

Company Country Ticker View
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Develops advanced materials and components for semiconductor, electronics, and automotive industries.
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Türkiye CWENE
DAEDUCK Co.,LTD Logo
Specialized maker of advanced PCBs & IC substrates for AI, 5G, and autonomous driving.
South Korea 008060
DAEDUCK ELECTRONICS CO.,LTD Logo
Manufactures high-end PCBs & IC substrates for AI, 5G, and autonomous driving tech.
South Korea 353200
DAISHINKU CORP. Logo
Manufactures crystal timing devices for auto, telecom, and consumer electronics.
Japan 6962
Daiwa Co.,Ltd. Logo
One-stop PCB solutions for power electronics, automotive, and industrial equipment.
Japan 8247

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