AOI ELECTRONICS CO.,LTD.
Provider of outsourced semiconductor packaging and testing (OSAT) for various electronic components.
6832 | T
Overview
Corporate Details
- ISIN(s):
- JP3105280006
- LEI:
- Country:
- Japan
- Address:
- 高松市香西南町４５５番地の１
- Sector:
- Manufacturing
- Industry:
- Manufacture of electronic components and boards
Description
AOI ELECTRONICS CO., LTD. is a manufacturer of electronic components and integrated circuits. The company specializes in providing outsourced semiconductor packaging and testing (OSAT) services. Its diverse product portfolio includes Integrated Circuits (ICs), modules, optical sensors, LEDs, thermal print heads, resistor networks, and MEMS devices. AOI ELECTRONICS focuses on developing advanced packaging technologies to meet various market requirements, such as high-density mounting and high heat dissipation, delivering tailored solutions to its customers.
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Filings
| Date | Filing | Language | Size | Actions | |
|---|---|---|---|---|---|
| 2025-06-27 08:03 |
Post-Annual General Meeting Information
臨時報告書
|
Japanese | 23.6 KB | ||
| 2025-06-27 07:18 |
Governance Information
内部統制報告書－第57期(2024/04/01－2025/03/31)
|
Japanese | 22.0 KB | ||
| 2025-06-27 07:16 |
Registration Form
確認書
|
Japanese | 8.0 KB | ||
| 2025-06-27 07:15 |
Annual Report
有価証券報告書－第57期(2024/04/01－2025/03/31)
|
Japanese | 1.1 MB | ||
| 2024-11-14 08:47 |
Report Publication Announcement
確認書
|
Japanese | 8.0 KB | ||
| 2024-11-14 08:44 |
Interim Report
半期報告書－第57期(2024/04/01－2025/03/31)
|
Japanese | 186.4 KB | ||
| 2024-06-26 03:29 |
Post-Annual General Meeting Information
臨時報告書
|
Japanese | 22.0 KB | ||
| 2024-06-26 03:28 |
Governance Information
内部統制報告書－第56期(2023/04/01－2024/03/31)
|
Japanese | 21.8 KB | ||
| 2024-06-26 03:27 |
Registration Form
確認書
|
Japanese | 8.0 KB | ||
| 2024-06-26 03:26 |
Annual Report
有価証券報告書－第56期(2023/04/01－2024/03/31)
|
Japanese | 1.1 MB | ||
| 2024-03-18 07:07 |
Major Shareholding Notification
臨時報告書
|
Japanese | 20.2 KB | ||
| 2024-03-15 03:57 |
Regulatory News Service
臨時報告書
|
Japanese | 19.5 KB | ||
| 2024-02-14 04:48 |
Report Publication Announcement
確認書
|
Japanese | 8.0 KB | ||
| 2024-02-14 04:46 |
Quarterly Report
四半期報告書－第56期第3四半期(2023/10/01－2023/12/31)
|
Japanese | 152.8 KB | ||
| 2024-01-12 08:08 |
Major Shareholding Notification
臨時報告書
|
Japanese | 20.0 KB |
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Market Data
Market Data Not Available
Financials & KPIs
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Insider Transactions
| Date | Insider Name | Position | Type | Shares | Value |
|---|---|---|---|---|---|
| No insider transactions recorded for this company. | |||||
Peer Companies
