SÜSS MicroTec SE — Investor Presentation 2011

Aug 15, 2011

Company Presentation February 2011Investor PresentationSummer/Fall 2011

Disclaimer

1

This presentation contains forward-looking statements relating to the business, financial performance and earnings of SUSS MicroTec AG and its subsidiaries and associates. Forward-looking statements are based on current plans, estimates, projections and expectations and are therefore subject to risks and uncertainties, most of which are difficult to estimate and which in general are beyond the control of SUSS MicroTec AG.Consequently, actual developments as well as actual earnings andperformance may differ materially from those which are explicitly or implicitly assumed in the forward-looking statements. SUSS MicroTec AG does not intend or accept any obligation to publish updates of these forward-looking statements.

Content

• I.Executive Summary
• II.Products and Markets
• III.Growth Opportunities
• IV.Financials
• V.Outlook
• VI.Appendix

SUSS MicroTec Spotlight

• SUSS MicroTec: A global leader in semiconductor equipment
• Our equipment and process solutions create the micro structures that build and connect micro electronic devices
• We are focused on high growth market segments: Semiconductors, MEMS, LEDs

Key Data*:

• Bloomberg Symbol: SMH
• TecDax
• Share price: 8.72 €
• Market Cap: 166 Mio. €
• Net Cash: 35.5 Mio. €

Optimizing Structures – Shaping the Future

Garching

• SUSS MicroTec AG HQ
• Development and production:
• Mask Aligner
• Bond Aligner
• Core competencies:
• Exposure
• Alignment

Sternenfels

• Development and production :
• Bonder
• Coater and Developer
• Photomask Equipment
• Core competencies :
• Wet processing
• Wafer bonding

SUSS MicroTec – A Global Player

Order Intake and Sales by Region H1 2011 continuing operations

Content

• I.Executive Summary
• II.Products and Markets
• III.Growth Opportunities
• IV.Financials
• V.Outlook
• VI.Appendix

SUSS MicroTec In The Value Chain

• SUSS MicroTec is a key player in providing state-of-the-art semiconductor manufacturing equipment
• With industry and R&D partners we develop highly innovative systems addressing the fundamental challenges of semiconductor manufacturing

With SUSS MicroTec's manufacturing solutions the components are built out of which cell phones, PCs, tablet computers, TV sets etc. are made

Divisions and Products

Products and Markets

P d t r o u c s	M k T k a s r a c	M k A l i a s g n e r	C / t o a e r D l e v e o p e r	W f B d a e r o n e r
S P t r o c e s s e p s	F d t r o n e n	B k d a c e n
	P h k t o o m a s C l i e a n n g	A l i t g n m e n E x p o s u r e N I i i t a n o m p r n n g	C i t o a n g D l i e v e o p n g	B d A l i t o n g n m e n P B d i t e r m a n e n o n n g T B d i e m p o r a r y o n n g
M k t a r e s	M k M k i a s a n g	A d d P k i v a n c e a c a g n g 3 D I i t t n e g r a o n - M E M S L E D

Semiconductors

• SUSS MicroTec offers solutions for performance and yield critical steps in semiconductor manufacturing
• Front End: Mask Cleaning
• Back End: Advanced Packaging 3D Integration

Mask Cleaning

Maintains mask integrity of 193i sub 22nm, EUVL and NIL lithography

Advanced Packaging

Micro-bumping replaces wire-bonding for high-end integrated circuits

3D Integration

Stacking chips allows for higher device complexity

MEMS and LED

• ^Micro Electro Mechanical Systems are micromechanical devices with electrical functions typically sensors
• They are found in an increasing number of applications
• Automotive
• Industrial process control sensors

• Consumer electronics

• Light Emitting Diodes (LED) - are used for signaling and illumination

• Ultra High Brightness LED allow solid state lighting
• UHB LEDs go into rapidly growing markets like
• Automotive
• Consumer electronics
• Room lighting

Content

• I.Executive Summary
• II.Products and Markets
• III.Growth Opportunities
• IV.Financials
• V.Outlook
• VI.Appendix

Mega Trends driving the Industry

• Global mega trends drive the micro electronics industry and create long term opportunities
• Digital Lifestyle
• E-Mobility
• Energy efficiency
• Micro chips, MEMS und LEDs are the building blocks for the technological product advancement
• SÜSS MicroTec's focus is to offer development and manufacturing solutions for these components in markets that have a sustainable long term growth perspective

Digital lifestyle

E-mobility

Energy efficiency

Enabling Semiconductor Trends

• The further increase in complexity and performance of future semiconductor device generations demands the continuous progress in scaling of these devices
• SÜSS MicroTec's equipment and process solutions enable the 2-dimensional reduction of feature sizes ("Moore's Law") as well as the 3-dimensionalstacking of integrated circuits ("More than Moore")

2-D vs. 3-D Scaling

• Technical challenges and limitations make it increasingly more expensive to pursue the shrink roadmap of integrated circuits

• While alternatives like 3D integration promise greater space efficiency, lower power consumption and a significant increase in performance they will not replace shrinking

• For the years to come shrinking and stacking technologies will coexist, each having it's unique set of challenges

• SUSS MicroTec is one of the few companies offering HVM equipment and process solutions for 2-dimensional and 3-dimensional scaling

Growth Opportunities

• The company's long term growth perspective derives from the double digit growth rates of the target markets 3D Integration, Advanced Packaging, LED and MEMS
• SUSS MicroTec is one of the leading suppliers for wafer bonders in the semiconductor industry offering a broad portfolio of permanent and temporary bonding equipment and process solutions
• The wafer bonder equipment market is estimated to grow rapidly to a size of larger 500 million \$ within the next few years
• SUSS MicroTec targets a market share of 30%+ which is in line with the current market position

Source: Yole Développement

Market Forecasts

Sternenfels – Site for volume manufacturing

• Three product lines under one roof
• Photomask Equipment - Coater / Developer - Bonder
• Modern production facility (15,000 m²) with two large clean rooms supporting future business expansion

Shaping the future

• SÜSS MicroTec is a successful global player with
• Strong brand standing for
  • -Precision
  • -Reliability
  • -Longevity
• Technological innovation
• Taylored equipment and process solutions
• Global footprint

SUSS MicroTec is the industry's reliable partner to meeting today's and tomorrow's challenges in semiconductor manufacturing

Content

• I.Executive Summary
• II.Products and Markets
• III.Growth Opportunities
• IV.Financials
• V.Outlook
• VI.Appendix

30 Months Business Development

EBIT, Free Cash Flow and Net Cash Development

in i l l io € m n	H 2 0 1 1 1	H 2 0 0 1 1	F Y 2 0 0 1	F Y 2 0 0 9
O d I k t r e r n a e	8 0. 4	8 2. 9	8 9. 3 1	9 3. 3
f p O d B k l ( d io d ) e n o e r r e r a c o g	0 9. 8 1	8 9. 9	6. 1 1 1	0 5 7.
R
e e nu e v	8 4. 7	9. 6 5	3 9. 1 1	0 3. 9 1
E B I T	1 0. 6	3. 5	1 4. 3	2. 8
f S E B I T in % le o a s	1 2, 5 %	5. 9 %	1 0. 3 %	2. 7 %
E i f t t a r n n g s a e r a x	8. 3	1. 1	3. 0 1	0. 5
E P S i ( b ic ) € a s n	0. 4 4	0. 0 6	0. 7 1	0. 0 3
F C h F l * r e e a s o w	-2 5	6. 0	1 4. 1	8. 9
C N h ** t e a s	3 5. 5	2 5. 6	3 4. 6	1 8. 4

* Before consideration of purchase or sale of available-for-sale securities and before consideration of extraordinary items from purchase or sale of subsidiaries

** incl. interest-bearing securities

Segment Reporting H1 2011 continuing operations

Segment Reporting H1 2011 continuing operations

i i l l i € n m o n		L i h h t o g r a p y	S b t t s r a e u B d o n e r	P h k t o o m a s E i t q u p m e n	O h t e r s	T l t o a
O d I k t e r n a e
	H 2 0 1 1 1	6. 3 5	9. 3	1 1. 4	3. 4	8 0. 4
	H 2 0 0 1 1	9 5 4.	0. 1 5	0 1 4.	3. 5	8 2. 9
S l a e s
	H 1 2 0 1 1	5 2. 5	7. 7	2 0. 7	3. 8	8 4. 7
	H 1 2 0 1 0	3 8. 5	1 2. 1	6. 1	2. 9	5 9. 6
S E B I T t- e g m e n
	H 1 2 0 1 1	1 3. 1	-5 0	4. 3	-1 9	1 0. 6
	H 2 0 0 1 1	0 7.	-4 1	0. 2 -	0. 7	3. 5
E l f 0 6 / 3 0 m p o y e e s a s o
	H 1 2 0 1 1	3 3 0	1 3 4	1 0 8	6 0	6 3 2
	H 1 2 0 1 0	3 1 9	1 2 5	8 4	5 3	5 8 1

Content

• I.Executive Summary
• II.Products and Markets
• III.Growth Opportunities
• IV.Financials
• V.Outlook
• VI.Appendix

Outlook

Outlook

• Strong competitive positioning: first or second in the target markets Double-digit growth rates in target markets for the years to come
• Strong growth potential for the Substrate Bonder Division
• Expansion of the solid financial situation and increasing profitability

Investment case

• Strong balance sheet, lean cost structure
• Strong fundamental growth in target markets
• Significant mid term revenue opportunity
• Strong competitive positioning: first or second in the target markets
• Evolve to a leading company in the semiconductor backend, enabling 3D integration while supporting "Moore's Law" as well as "More than Moore"
• Participate in the consolidation of the backend

Content

• I.Executive Summary
• II.Products and Markets
• III.Growth Opportunities
• IV.Financials
• V.Outlook
• VI.Appendix

SUSS MicroTec Share - Overview

Share price and Trading Volume

Average daily trading volume: - 2009: 46 ths. - 2010: 120 ths. -2011: 265 ths.

Share price development in 2010/2011:

• -Year high: 9.14 €
• Year low: 3.71 €

-Year end: 9.14 €

-Year high in 2011: 13.57 €

Analyst coverage increased from 4 to 6

Long Term Development of the SUSS MicroTec Share

(Price of the SUSS MicroTec Share at January 4, 2010: € 4,40)

Jan. Feb. M rz. Apr. M ai. Jun. Jul. Aug. Sep. Okt. Nov. Dez. Jan. Feb. M rz. Apr. M ai. Jun. Jul. Aug.

Investor Relations Information

Contact

Franka Schielke

Tel.: +49 (0) 89-32007- 161Fax.: +49 (0) 89-32007- 451Email: franka.schielke@suss.com

SÜSS MicroTec AGSchleissheimer Strasse 9085748 Garching (Munich)Germanywww.suss.com

Financial Calendar 2011

In im Re 2 0 te t 1 1 r p or	Au t 4 g us
T M T Co fer Co ba k, Fr k fu t n en ce mm er z n an r	Au 3 1 t g us
U B S Be f Ge Co fe Ne Yo k t o s rm an y n re nc e, w r	Se be 1 4 / 1 5 tem p r
Co Be be Inv fe Pa is tm t ren rg es en n ren ce r ,	Se be 1 5 tem p r
Un i Cr d i Inv Co fer Mu ic h t tm t e es en n en ce n ,	Se be 2 7 tem p r
N ine h Re 2 0 t t 1 1 -m on p or	No be 8 ve m r
T M T Co fer Mo S ley Ba lon tan n en ce rg an rce a ,	No be 1 7 ve m r
Ge Eq i Fo Fa l l 2 0 1 1 ty rm an u ru m	No 2 1 - 2 3 ve me r

The Restructuring Measures in Numbers

P h f H T h u r c a s e o a m a e c	P h i d d b i l d i € i l l i 4. 4 r c a s e p r c e g r o n a n n g m o n u u u : P h i H T h 3. 8 € i l l i u r c a s e p r c e a m a e c m o n : E i 2 0 3 0 0, 0 0 0 € 1 1 t t a r n- o p a m e n n u y :
S l f T S t t a e o e s s e m s y	C h i f l i 2 0 0 3. 3 € i l l i € 1 a s n o w n m o n : C h i f l i 2 0 3. 3 M i € ( f C d h ) 1 1 a s n o n o r o m a s c a e- s a r e s w : f h i b l h i f l i l 0 2 0 2 € i l l i 1 / 1 1. 5 t t u r e r p o s s e c a s n o w u n : m o n
S T f b B d t t r a n s e r u s r a e o n e r	C i 2 0 0 3. 9 € i l l i 1 t o s s n m o n : C i Q 2 0 € i l l i 1 1 1 1. 1 t o s s n m o n : f h i i l l i 2 0 1 1 1. 0 € t t u r e r c o s s n m o n : ~

Example: MEMS

Increase yield:

• High-performance exposure optics
• Cost-efficient alignment verification
• High –topography spray coat & develop
• Full-wafer imprint in one step
• High force, high temperature wafer bonding for metal bonds

Photolithography

Example: LED

Reduce cost per lumen with efficientprocess technologies:

• Multi-wafer processing and handling
• High performance exposure optics
• Warped wafer tooling
• Special pattern recognition

Example: 3D-Integration

3D-Scaling:

• Flexible equipment for multiple temporary bond and debond processes
• Superior pressure uniformity at bonding
• Thin wafer handling
• TSV processing with high performance exposure optics
• Uniformity spray coating for high topographies

3D Integration: Chip Design Using the Third Dimension

Thin Wafer Handling with SUSS Equipment

Sustainability: Example Data Traffic (3D Integration)

• Smartphones & Media Tablets drive explosive data growth (+159% global increase in mobile traffic in 2010)
• To handle the massive amounts of data the infrastructure of data centers across the globe needs to be expanded
• Today's typical power consumption of one data center:
• 174M KW Power (22M KW for memory)
• 2.5W of cooling required for every 1W of power going into the server
• 125.6K Tons of Co2 emissions
• Advanced Silicon Technology (3D) offers dramatic reduction in power consumption

SUSS MicroTec equipment for Advanced Packaging and 3D Integration enables the development and production of energy efficient devices

Sustainability: Case Study Data Centers

Data Center "A"

Data Center "B"

Advanced Silicon Technology (3D) offers dramatic reduction in power consumptionSource: www.epa.gov

SUSS Management Board

Frank Averdung, CEO

• 1984: Degree in Electrical Engineering from the University of Aachen
• 1985 to 1990: Key Account & Product Marketing Manager, Siemens AG, Munich / Santa Clara, USA
• 1990 to 1992: Corporate Marketing Manager, National Semiconductor
• 1992 to 1995: Marketing Director US & Far East und Head of ITT Semiconductor US, ITT Semiconductors
• 1995 to 1998: General Manager Global Business Operations Siemens, Applied Materials
• 1998: General Manager Central Europe & Eastern Europe, Applied Materials
• 1999 to 2003: Managing Director Europe, ETEC
• 2003 to 2006: Managing Director, NaWoTec GmbH
• 2005 to 2009: Managing Director, Carl Zeiss SMS GmbH und President & General Manager, Carl Zeiss SMT Inc.
• CEO of SUSS MicroTec AG since February 1, 2009

Michael Knopp, CFO

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