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Scientech Investor Presentation 2017

Nov 28, 2017

52347_rns_2017-11-28_901bd491-1104-4226-9282-9341e0570406.pdf

Investor Presentation

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(3583)

2017/11/29

1

Safe Harbor Statement

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  • This Presentation contains certain forward-looking statements that are based on current expectations and are subject to known and unknown risks and uncertainties that could cause actual results to differ materially from those expressed or implied by such statements.

  • Except as required by law, we undertake no obligation to update any forward –looking statements, whether as a result of new information, future events or otherwise.

2

Scientech Corp (3583: TT)

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|||
|---|---|
|Company|
|Establishment|1979/10/17|
|IPO|2013/3/12|
|Capital|NT$ 811 Million|
|Chairman|H.L. Hsieh|
|President|M.T. Hus|
|、|、|
|Equipment Manufacturing|Wafer Reclaim|
|Products|
|Trading(Agent/Distributor)|

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3

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Business Overvies Products

Future Prospect

4

Business Overview

Income Statement

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UnitsNT $ M 2013 2014 2015 2016 3Q17 1Q~3Q17
Revenues 3,068 2,717 2,942 3,495 885 2,428
Gross Profit 983 970 903 1,178 335 864
Operating Expenses 629 673 779 835 215 611
Operating Income 354 297 124 343 120 253
Other Income and
Expenses
(26) 20 (6) 21 (15) (26)
Income Before Tax 328 317 119 363 105 227
Net Income 249 246 86 292 86 177
EPS 3.11 3.04 1.06 3.60 1.06 2.18
Gross Margin 32.04% 35.71% 30.69% 33.71% 37.91% 35.60
Operating Margin 11.53% 10.93% 4.23% 9.80% 13.62% 10.44%
Income Before Tax
margin
10.69% 11.68% 4.03% 10.40% 11.86% 9.33%

5

Business Overview

Products Mix

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Units% 2013 2014 2015 2016 1Q~3Q17 Gross
Margin
Trading 59 50 59 51 52 Below
Average
Manufacturing 41 50 41 49 48 Above
Average

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6

Business Overview

R&D Expenses

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UnitsNT $ M 2013 2014 2015 2016 1Q~3Q17
R&D Expenses 131 160 196 226 171
Expenses as %
of Revenue
4.27% 5.89% 6.66% 6.48% 7.06%

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Products

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Wet Process
Equipment
Equipment
Manufacturing
Trading
Wafer
(Agent/Distr
Reclaim
ibutor)
Semiconductor and 12” Wafer
Optoelectronics
Reclaim
Process Equipment
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Products

Equipment Manufacturing

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Wet process equipmentSingle wafer/ Batch type

8”/12’ Advanced packaging 、 、 (Fan-out Solder Bump 、 、 Copper Pillow Bumping 、 、 Gold Bump RDL TSV …ect)

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6”/ 8”/12” Front-end special process (IoT Sensor Power IC 、 、 FP sensor RF CMOS Touch 、 Controller MEMS)

  • HB LED fully-automatic process

  • MEMS

  • III-V

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Products Si Wafer Reclaim

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Advanced clean technology
Complete particle inspection
20nm/ 16nm Particle
• (SP1-DLS & SP2)
Low trace metal (<5E9)

 12” Wafer Reclaim
Cleaning Etching

Capacity: 120K / month

Separated Cu & Non Cu
Line
Full Process
Optimization
Polishing Grinding
Complete polishing process Super flatness
Single side polish • (GBIR<0.5 m m)
Double side polish

Final Haze polish 10

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Products

Trading (Agent/Distributor)

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Multi
Exclusive
applicati
Agency
on
Supply Chain
Partnership
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11

Future

Prospect

Product-based Extension

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Wet Process Equipment ------------------- Wafer Support System Equipment Mass Spectrometer Manufacturing Trading Wafer (Agent/Distr Reclaim ibutor)

Semiconductor and Optoelectronics Process Equipment


AMOLED

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12” Wafer Reclaim ------------------- SiC Wafer Reclaim

12

Q & A

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Thank You!

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