KINSUS — Investor Presentation 2015

Mar 5, 2015

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景碩科技股份有限公司
Kinsus Interconnect Technology Co.
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2015 Feb

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IC 封裝技術 IC Packaging Technology

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電子產品構裝的各個層次
晶圓
IC
印刷
電路板
系統
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Levels of Assembly in Electronic Devices
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Wafer Level IC Level PCB Level System Level

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各種形式的 IC 封裝
SOIC/SSOP/
SOT/SOD
Chips DPAK SOJ
OSOP/TSSOP/
MSOP/HSOP
BGA/Flip-Chip
OFP/TOFP PLCC CLCC
TSOP
/WLP
/LOFP
Axial
Radial
DFN
QFN
DIP Through-hole
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Different types of IC packaging
SOIC/SSOP/
SOT/SOD
Chips DPAK SOJ
OSOP/TSSOP/
MSOP/HSOP
BGA/Flip-Chip
OFP/TOFP PLCC CLCC
TSOP
/WLP
/LOFP
Axial
Radial
DFN
QFN
DIP Through-hole
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封裝技術走向

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Packaging Technology Roadmap

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IC 結構
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What Substrate Makers do?

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IC 半導體上下游供應鏈關係
IC 設計
IC
設計圖
設計圖
晶圓製造 封裝
晶圓r
設計圖
載板
載板製造
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IC Manufacturing Supply Chain
IC Design
/ Fabless
IC
Design
Design
Foundry Wafer OSAT
Design Substrate
Substrate
house
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About Kinsus

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基本資料
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• 成立September 2000 上市November 2004

• 登記資本額新台幣44.6 億

• 員工數: 3,600 (2015 一月)

• - 廠區: 總部 石磊/ 新屋鄉 - 硬質載板事業部 一廠, 二廠 - 四廠 - 軟質載板事業部 四廠 - 美國子公司 Santa Clara / California - 中國子公司 蘇州

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Basic Information
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• Established in September 2000

IPO in November 2004

• Capital : US$ 154 Million (NT$ 4.46 Billion)

• Headcounts : 3,600 as of January 2015

• Campus : Headquarters Rigid Substrates BU

• Shih Lei / Sin Wu

• Plant I, Plant II

• Plant VI

Flexible Substrate BU - Plant VI Kinsus USA Kinsus China - Suzhou

• Santa Clara / California

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位置
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美國子公司

Kinsus Suzhou (統碩) 一廠 Piotek (百碩) 二廠A&B 三廠 景碩自有廠房辦公室 業務代表 / 代理 四廠

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Locations
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Kinsus USA

Kinsus Suzhou (統碩)

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Piotek (百碩)

Kinsus owned facility Service representative

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Taiwan plant I Taiwan plant II-A & B Taiwan plant III Taiwan plant VI

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硬質載板產品
Desk Top, Server, Switch,
PCMCIA cards, Set-Top Box,
notebook, Home Game,
video cameras CPU / BUS boards
Conventional EBGA
Fine Pitch Laser EBGA
PBGA Cavity Down
FC CSP Thin CSP
Flip Chip CSP
Digital camera,
FC High IOs Chip Array
Cellular,
wireless,
MP3 Player,
Module
DROM
COB SIP
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Rigid Substrate Products
Desk Top, Server, Switch,
PCMCIA cards, Set-Top Box,
notebook, Home Game,
video cameras CPU / BUS boards
Conventional EBGA
Fine Pitch Laser EBGA
PBGA Cavity Down
FC CSP Thin CSP
Flip Chip CSP
Digital camera,
FC High IOs Chip Array
Cellular,
wireless,
MP3 Player,
Module
DROM
COB SIP
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軟質載板產品
TAB
SIM
DS
cards
COF
SS
Ink COF
Jet
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Flexible Substrate Products
TAB
SIM
DS
cards
COF
SS
Ink COF
Jet
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每月營業額
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單位: 新台幣百萬元

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Monthly Revenue
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Unit : Million NT$

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營業額分佈

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Revenue - Application

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Thank You!