Etteplan Oyj — Capital/Financing Update 2011

Oct 26, 2011

ETTEPLAN OYJ: ANNOUNCEMENT OF HYBRID BOND PAYBACK

ETTEPLAN OYJ: ANNOUNCEMENT OF HYBRID BOND PAYBACK

ETTEPLAN OYJ, STOCK EXCHANGE RELEASE, OCTOBER 26, 2011, AT 07.30 A.M.

ANNOUNCEMENT OF HYBRID BOND PAYBACK

Etteplan Oyj issued a EUR 10 million hybrid bond on December 1, 2009. The
coupon rate of the bond is 9.50% per annum. The bond has no maturity but the
company may call the bond after two years.

The company will pay the EUR 10 million capital as well as the accumulated
9.50% coupon rate according to bond terms and within the time limits of the
bond terms on December 1, 2011.

Hollola, October 26, 2011

Etteplan Oyj

Board of Directors

Additional information:
Per-Anders Gådin, CFO, tel. +46 70 399 7929

DISTRIBUTION:
NASDAQ OMX Helsinki
Major media
www.etteplan.com

Etteplan is a specialist in industrial equipment engineering and technical
product information solutions and services. Etteplan's engineering expertise
and service products cover the entire life cycle of the client's products. Our
customers are global leaders in their fields and operate in areas like the
automotive, aerospace and defense industries as well as the electricity
generation and power transmission sectors, and material flow management.

Etteplan has comprehensive competence in electronics and embedded systems
development, automation and electrical design, mechanical design and technical
product information solutions and services.

In 2010, Etteplan had turnover of EUR 104.8 million. The company currently has
approximately 1,600 experts in Finland, Sweden, and China. Etteplan's shares
are listed on NASDAQ OMX Helsinki Ltd under the ETT1V ticker.