Easy Technologies Inc. — Board/Management Information 2021

Mar 11, 2021

EASY TECHHNOLOGIES PROVIDES CORPORATE UPDATE

Vancouver, British Columbia – February 26, 2021 – Easy Technologies Inc. (CSE: EZM) (Frankfurt: EY62), (OTC: EMYSF) (“Easy” or the “Company”) announces that at its most recent Board of Directors’ meeting, Mr. Robert Rosner and Mr. Michel Lebeuf have joined Mr. Jack Bal and Mr. Peter Wilson as new Board members of the Company. Mr. Michel Lebeuf has been appointed as interim president of the Company.

For additional information contact

Peter Wilson, CEO Email to peter@ludgatehillpartners.com Phone: 604-484-8989

Certain statements contained in this release may constitute “forward–looking statements” or “forward-looking information” (collectively “forward-looking information) ” as those terms are used in the Private Securities Litigation Reform Act of 1995 and similar Canadian laws. These statements relate to future events or future performance. The use of any of the words “could”, “intend”, “expect”, “believe”, “will”, “projected”, “estimated”, “anticipates” and similar expressions and statements relating to matters that are not historical facts are intended to identify forward-looking information and are based on the Company’s current belief or assumptions as to the outcome and timing of such future events. Actual future results may differ materially. In particular, this release contains forward-looking information relating to the business of the Company, the Property, financing and certain corporate changes. The forward-looking information contained in this release is made as of the date hereof and the Company is not obligated to update or revise any forwardlooking information, whether as a result of new information, future events or otherwise, except as required by applicable securities laws. Because of the risks, uncertainties and assumptions contained herein, investors should not place undue reliance on forward-looking information. The foregoing statements expressly qualify any forward-looking information contained herein.

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