Skip to main content

AI assistant

Sign in to chat with this filing

The assistant answers questions, extracts KPIs, and summarises risk factors directly from the filing text.

COMPEQ Investor Presentation 2021

Oct 14, 2021

52002_rns_2021-10-14_305cff5e-8494-4fa6-a689-b3c7e14e5493.pdf

Investor Presentation

Open in viewer

Opens in your device viewer

==> picture [148 x 142] intentionally omitted <==

==> picture [557 x 100] intentionally omitted <==

Copyright © 2021 Compeq Co., Ltd. All Right Reserved

免責聲明

  • 於法人說明會中,應注意預測性營業收入或獲利資訊之發言,且會中所揭露資訊 (含簡報檔及口頭說明),不得有誇耀性或類似廣告宣傳之文字,不應任意發布 尚未確定之消息或公開與事實不符之資料等,敬請落實轉達貴公司高層發言人 員,以免違反本公司「對有價證券上市公司重大訊息之查證暨公開處理程序」第 15 條第 1 項第 2 款及第 3 款規定,或「對上市公司應公開完整式財務預測之認定標 準」規定,致有編製財務預測之虞。

  • 除歷史事件之陳述外,本文件均為前瞻性敘述。該前瞻性敘述包括已知及未知風 險、不確定性及其他可能導致華通電腦股份有限公司之實際表現、財務狀況或營 運結果與該前瞻性敘述所包含者產生重大差別之因素。

  • 本免責聲明中之財務預測及前瞻性敘述為目前華通電腦股份有限公司截至本文件 之日之信念所編製。華通電腦股份有限公司不負責更新這些預測及前瞻性敘述以 反映此日期後所發生之事件或情況。

  • 歷史事件的陳述可能包括未經會計師審閱之資訊,其可能有某些不足或缺陷而無 法忠實呈現目前華通電腦股份有限公司之財務狀況或營運結果

==> picture [133 x 33] intentionally omitted <==

Copyright © 2021 Compeq Co., Ltd. All Right Reserved

COMPEQ continues to provide “One-Stop Service”

==> picture [133 x 117] intentionally omitted <==

HDI PCB

Smart Phone Tablet Ultrabook Wearable Consumer

==> picture [134 x 118] intentionally omitted <==

==> picture [140 x 123] intentionally omitted <==

COMPEQ One-Stop PCB Service Provider

Flexible PCB Battery module LCD module Camera module Wearable Accessory

Multilayer PCB Satellite Communication 4/5G Base Station Cloud Data computing High Performance Networking

==> picture [226 x 123] intentionally omitted <==

SMT Assembly

Rigid-Flex PCB Battery module LCD module Camera module Wearable

Battery module Automotive Medical Accessory

==> picture [133 x 33] intentionally omitted <==

P1

Copyright © 2021 Compeq Co., Ltd. All Right Reserved

COMPEQ - Worldwide Leading High-tech PCB Vendor

NT$60,517 million revenue in 2020 #6 PCB manufacturer Worldwide #1 In HDI, Worldwide

7 Cost-competitive & high-tech facilities in Taiwan & China

20,800 Employees

7% in 2016 – 2020 CAAGR

==> picture [133 x 33] intentionally omitted <==

P2

Copyright © 2021 Compeq Co., Ltd. All Right Reserved

Global Operations

ChongqingII
Y2021
600 employees
92K M2
Module 1
Module 2
ChongqingII
Y2021
600 employees
92K M2
Module 1
Module 2
ChongqingII
Y2021
600 employees
92K M2
Module 1
Module 2
ChongqingII
Y2021
600 employees
92K M2
Module 1
Module 2
ChongqingII
Y2021
600 employees
92K M2
Module 1
Module 2
ChongqingII
Y2021
600 employees
92K M2
Module 1
Module 2
ChongqingII
Y2021
600 employees
92K M2
Module 1
Module 2
Chongqing I Suzhou Huizhou SMT Huizhou FPC Huizhou Dayuan Luzhu
Y2014 Y2004 Y2012 Y2004 Y1996 Y1998 Y1973
2,200 employees 1,000 employees 1,700 employees 5,400 employees 5,200 employees 1,200 employees 3,500 employees
56K M2 42K M2 27K M2 150K M2 151K M2 42K M2 90K M2

==> picture [133 x 33] intentionally omitted <==

P3

Copyright © 2021 Compeq Co., Ltd. All Right Reserved

COMPEQ Competitive Advantages

==> picture [98 x 90] intentionally omitted <==

----- Start of picture text -----

Quality
----- End of picture text -----

Compliant worldwide recognized quality standard and certifications. Quality management system prioritized to fulfill customer specifications.

==> picture [98 x 89] intentionally omitted <==

----- Start of picture text -----

Technology
----- End of picture text -----

Leading 25/25µm line and spacing substrate-like Anylayer with mSAP, Wide range high end hybrid multilayers, unique flex and rigid flex boards.

==> picture [98 x 90] intentionally omitted <==

----- Start of picture text -----

CSR
----- End of picture text -----

y Long term commitment to community, employee, suppliers, customers and investors. Focus on labor rights, business ethic, energy saving, and environment protection.

==> picture [189 x 169] intentionally omitted <==

----- Start of picture text -----

Service
Long term
Partnership
----- End of picture text -----

One-Stop Service, from design-for-manufacturing solution to field application support, worldwide service network to full product line include HDI, RPCB, RFPC, FPC to SMT.

Steady growth under the sustainable business philosophy.

==> picture [133 x 33] intentionally omitted <==

P4

Copyright © 2021 Compeq Co., Ltd. All Right Reserved

Operation Revenue – By Application

Units: MNTD

==> picture [631 x 344] intentionally omitted <==

----- Start of picture text -----

60,517
56,175
53,964
22%
50,828 YOY +7.7%
22%
45,515 24% YOY -5.8% YOY +10.5% 3%
43,318
22% 1% 5%
YOY +18.6% 5%
24% 5% 10% 21%
3%
5% 12%
8%
3%
9% 5%
3% 24%
27% 25% 24% 10%
26%
25%
39% 42% 36% 36%
38% 36%
Y2016 Y2017 Y2018 Y2019 Y2020 Y2021
Mobile Phone PC related Consumer Networking & Telecom System Aerospace SMT
----- End of picture text -----

==> picture [133 x 33] intentionally omitted <==

P5

Copyright © 2021 Compeq Co., Ltd. All Right Reserved

PCB Market Player/Position

Rank Country Supplier 2020 Revenue(MUSD)
1 TWN Zhen Ding 4,442
2 TWN Unimicron 3,117
3 JPN Nippon Mektron 2,594
4 CHN Dongshan Precision 2,523
5 USA TTM 2,105
6 TWN Compeq 2,048
7 TWN Tripod 1,891
8 CHN Shennan 1,664
9 TWN PSA 1,557
10 KOR SEMCO 1,504
11 JPN Ibiden 1,444
12 KOR Young Poong 1,408
13 CHN Kingboard 1,356
14 TWN Nan Ya 1,312
15 AUT AT&S 1,290

Source: Prismark, 2021

==> picture [133 x 33] intentionally omitted <==

P6

Copyright © 2021 Compeq Co., Ltd. All Right Reserved

PCB Market Player/Position - HDI Technology

==> picture [667 x 66] intentionally omitted <==

----- Start of picture text -----

Rank Country Supplier 2020 Revenue(MUSD)
1 TWN Compeq 986
----- End of picture text -----

2 AUT AT&S 772
723
667
589
496
488
347
234
222
3 TWN Unimicron
4 TWN Tripod
5 TWN Zhen Ding
6 CHN AKM Meadville
7 JPN Meiko
8 USA TTM
9 CHN Dongshan Precision
10 KOR Young Poong

Source: Prismark, 2021

==> picture [133 x 33] intentionally omitted <==

P7

Copyright © 2021 Compeq Co., Ltd. All Right Reserved

PCB Market Trend

Prismark expects the PCB industry to grow by 18% over 2020. All segments are expected to improve as the electronics industry as a while recovers in 2021, package substrates will continue to be the main driver.

Over the next few years, the 5G, Automotive, Wearable segment will continue to outpace the overall market, Prismark forecast 5.8% growth (CAAGR 2020-2025) in the near future, package substrate and HDI growth above average.

==> picture [499 x 337] intentionally omitted <==

----- Start of picture text -----

Units: $Bn 86.3
74.4
15.4
65.2 13.8
61.3
16.2
YOY +18.2%
12.5
13.0
12.2
10.2 13.7
8.1 11.7
10.0
9.0
31.7
29.3
23.9 24.8
8.1 7.8 9.2 9.3
2019 2020 2021(e) 2025(f)
Commodity Multilayer HDI Package Substrate Flex
----- End of picture text -----

Source: Prismark, 2021

==> picture [133 x 33] intentionally omitted <==

P8

Copyright © 2021 Compeq Co., Ltd. All Right Reserved

==> picture [148 x 142] intentionally omitted <==

==> picture [557 x 100] intentionally omitted <==

----- Start of picture text -----


----- End of picture text -----

Thank You For Your Attention

Copyright © 2021 Compeq Co., Ltd. All Right Reserved