Aspocomp Group Oyj — Director's Dealing 2017

Jun 2, 2017

Disclosure 352988

Aspocomp Group - Managers' transactions

ASPOCOMP GROUP OYJ - MANAGERS' TRANSACTIONS

Aspocomp Group Plc, Managers' transactions, June 2, 2017 at 8:50 a.m.

Aspocomp Group Oyj - Managers' Transactions

____________________________________________

Person subject to the notification requirement

Name: Joensuun Kauppa ja Kone Oy

Position: Closely associated person

(X) Legal person

(1):Closely associated person

Name: Borsos, Julianna

Position: Member of the Board

Issuer: Aspocomp Oyj

LEI: 743700W8ZIJAMXWWWD26

Notification type: INITIAL NOTIFICATION

Reference number: 743700W8ZIJAMXWWWD26_20170601204047_2

____________________________________________

Transaction date: 2017-06-01

Venue: NASDAQ HELSINKI LTD (XHEL)

Instrument type: SHARE

ISIN: FI0009008080

Nature of the transaction: ACQUISITION

Transaction Details

(1): Volume: 10000 Unit price: 2,73350 EUR

Aggregated transactions

(1): Volume: 10000 Volume weighted average price: 2.73350 EUR

ASPOCOMP GROUP PLC

Mikko Montonen

CEO

Aspocomp – a service company specializing in PCB technologies

Aspocomp specializes in demanding PCB technologies, serving its customers throughout the entire life cycle of a product. Aspocomp sells and manufactures PCBs and also provides related design and logistics services as well as technology solutions. Aspocomp creates value for its customers with unique products and solutions, strong manufacturing and technology expertise, as well as fast and reliable deliveries. A wide network of expert partners together with Aspocomp's own manufacturing enables its customers to cost-effectively buy their PCBs from a single provider over the entire life cycle of a product.

A printed circuit board (PCB) is the principal interconnection method in electronic devices. PCBs are used for electrical interconnection and as a component assembly platform in most electronic applications. Aspocomp's customers are companies that design and manufacture telecom systems and equipment, automotive and industrial electronics, security technology and semiconductor testing systems.