ADISYN LTD — Investor Presentation 2025

Jan 23, 2025

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AI1:ASX

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Investor Presentation

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Disclaimer

Disclaimer

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Vision

2D Generation is now 100% owned by Adisyn Ltd (AI1:ASX)

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Enabling the Future of Semiconductors

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2D Generation develops novel technologies and methods to produce high quality Graphene, in a low temperature process, improving the performance of semiconductor interconnects and other high technology applications.

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What’s New?

Non-Executive Director to be Appointed: Kevin Crofton

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Kevin Crofton has 3 decades of Semiconductor industry experience. He has held significant management and leadership positions at Lam Research Corporation (Nasdaq:LRCX, US$96B market cap), KLA Corporation (Nasdaq:KLAC, US$91B market cap), Comet Holdings AG (SIX: COTN, CHF1.9B market cap), Newport Corporation (acquired for US$980M), NEXX Systems (acquired by Tokyo Electron) and Aviza Technology.

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• In 2006, Mr. Crofton led a P/E backed buyout of Aviza Technology UK to create what became SPTS Technologies, where he was President and Managing Director from 2006 to 2020, and created a US$500M turnover, highly profitable, market leading company. SPTS was bought by Orbotech, which was later acquired by KLA for $3.4B.

• From 2020 through 2022, Kevin was CEO of Comet AG, a listed company on the Swiss SIX exchange. Achieved 60% revenue growth to CHF$600m (A$1.06B), nearly doubling EBITDA performance, and delivered Market Cap growth from 0.8B to 2.2B CHF (~US$2.4 B).

• Mr Crofton served on the board of SEMI, the international industry association, for 8 years including

as Vice Chair and Chair. He was advisor to Senator Mark Warner on US CHIPS Act and Gov. Glen Youngkin on Virginia's Semiconductor Initiative.

• Throughout his career, Kevin Crofton has been recognized for his contributions to the semiconductor industry. He is a published author of numerous technical papers, a sought-after Semiconductor industry speaker, and winner of numerous awards including the MEMS Industry CEO of the year (2013) and the Queens Award for innovation, technology and export in 2008, 2014 and 2018.

• Mr. Crofton holds an MBA in International Business from American University and a BS Degree in Aerospace Engineering from Virginia Tech.

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What’s New?

M&T Semiconductor Partnershi p

2D Generation Secures Semiconductor Industry Heavy Weights to Guide Business Development and Commercial Initiatives.

• M&T is incentivised to deliver strategic partnerships with equipment vendors, semiconductor fabricators, fabless chipmakers and end users with the aim of securing licencing transactions and/or a buyout.

• M&T specialises in managing technological and commercial initiatives in the semiconductor sector

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• M&T is led by industry leaders Dr. Itzhak Edrei, former President of Tower Semiconductors (the world’s 6[th] largest semiconductor pureplay foundry) and Zmira Shterenfeld Lavie, former SVP R&D at Tower Semiconductor

• Tower Semiconductor’s largest shareholder with ~7.5% or ~US$430M in holdings, Senvest Management LLC, is also a Substantial Shareholder in AI1. Senvest is a New York based fund with almost US$4B in assets under management.

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What’s New? Latest Beneq ALD Machine

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New Generation Atomic Layer Deposition Machine Procured

• 2D Generation has ordered a highly specialised Atomic Layer Deposition (“ALD”) machine from Beneq. The cutting-edge technology will enable 2DG to accelerate technological development

• Beneq is a global leader in ALD equipment with customers spanning the semiconductor and electronics industries

• An ALD machine is utilised in the semiconductor industry to deposit extremely thin layers (down to the atomic layer) of material on to chips. They are found in most semiconductor fabs around the globe

• Complements ongoing work on 2D Generation’s existing ALD. Installation expected Q2CY25

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beneq.com

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What’s New?

Graphene applications in Photonics

Key Features of Graphene for Photonics:

The future of semiconductors

• Nonlinear Optical Response: Strong third-order nonlinearities.

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• Ultrafast Dynamics: Carrier relaxation in femtoseconds.

• Broadband Absorption: Effective across the visible to terahertz spectrum.

Nonlinear Optical Applications:

• Saturable Absorption: Enables mode-locked lasers for ultrafast pulse generation.

• Third-Harmonic Generation (THG): Frequency tripling for novel light sources.

• Four-Wave Mixing (FWM): Optical signal processing and wavelength conversion.

Photonic Devices:

• Optical Modulators

• Photodetectors - High sensitivity and broad spectral range (visible to IR).

Emerging Fields:

• Quantum Photonics

• All-Optical Switching

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Graphene Heterostructures – Photogating and Charge Transfer (Optical Modulator)

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We are in an era driven by data,
Artificial Intelligence and Connectivity
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1990 2005 2020 2025 2030+
Internet Era Social Media Age Collaborative Autonomous Integrated World
Economy Age Age
www
TODAY
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High Performance Computing’s Primary Need e. . AI Is The Quest for S eed… ( g , ) p

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…But limited by the ability to “shrink” design rules

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AMAT ITPC November 2024

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Semiconductor in AI

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1 High Performance: Increasing Speed of device 2 Low Power: Reducing Power Consumption 3 4 5

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What is an Interconnect?

• 2D Generation’s innovative technology centres around the aim of improving the performance and capabilities of the interconnect.

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• An interconnect in a semiconductor refers to the conductive pathways that connect different components or regions within an integrated circuit (IC).

• These interconnects are crucial for the functionality of the IC as they facilitate the flow of electrical signals between transistors, capacitors, resistors, and other elements on the chip.

• Interconnects can be made of various materials, typically metals like aluminium or copper, and they can be implemented in different layers within the semiconductor structure.

• As ICs have become more complex, with smaller and more densely packed features, the design and materials used for interconnects have evolved to address issues such as resistance, capacitance, and signal integrity but have reached scalability limitations.

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Why Graphene

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Graphene is a unique carbon structure. It consists of a single atom layer of carbon atoms arranged in a honeycomb lattice and is the world’s first two-dimensional (2D) material. Graphene boasts exceptional properties, highly valuable to the semiconductor industry, including:

• ✓ Superior Electrical Conductivity : outperforms copper and other traditional materials - ideal for high-speed interconnects

• ✓ Remarkable Thermal Conductivity : dissipates heat more efficiently than any other known material, making it essential for managing heat in high-performance electronic devices.

• ✓ Exceptional Strength and Flexibility : stronger than steel and incredibly flexible, opening possibilities for new types of flexible electronics, wearable devices, and other innovative products.

• ✓ High Transparency : is nearly transparent, making it suitable for applications like displays, touchscreens, and solar cells.

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2D Generation’s Process

• Unique and patented process

• ALD based

• Forming graphene directly on the wafer

• Use of patented precursors

• Low-temperature process – below 280°C.

• Compatible with current manufacturing limitations

• An addition of a tethering group is designed to increase adhesion to silicon oxide, metals, and other optional surfaces

• Can be applied using existing industrial processes and equipment

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Our process advantages

Revolutionizes the semiconductor industry with our patented, low-temperature ALD process for producing high-quality graphene interconnects for the next generation chip:

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Our innovative Atomic Layer Deposition (ALD) based process enabling graphene growth directly on silicon chips at significantly lower temperatures, compatible with chip fabrication.

Our unique process allows for selective graphene deposition on surface and within vias. This process can be applied to surfaces with a high aspect ratio.

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The Copper Interconnect Dilema…

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• Smaller and smaller design rules equals more transistors per chip – which means faster performance

• But the inherent resistance increases to the point that

• processing speed is ultimately limited by physics

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Delay
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Process technology scale down
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• Yosi Shacham-diamand, Tetsuya Osaka, Madhav Datta, and Takayuki Ohba. (Book) “Advanced Nanoscale ULSI Interconnects”. 2009.

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2DG – Enabling the future of semiconductors

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2D Gen’s tech harnesses graphene’s unique properties to boost chip performance. Our graphene-based solution accelerates the development of new advanced computing tech, including artificial intelligence (AI), photonics, spintronics, and autonomous vehicles.

We unlock a new era of semiconductor and electronics magnitude, paving the way for faster, more energy-efficient chips across various industries.

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Building the Future Together: Partnershi O ortunities p pp

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Connecting Chips – EU Undertakin g

Why is the Project significant?

2DG’s role in the Project

• The Project is focused on developing and integrating electronic, photonic, power, and RF devices within System in Package (SiP) modules for applications in data centers, high-performance computing, Artificial Intelligence, autonomous vehicles and digital industries.

Leveraging graphene’s exceptional properties through pioneering low-temperature ALD techniques, this technology improves semiconductor performance in interconnects, coatings, capping layers by addressing impedance, resistivity, and heat dissipation challenges.

What will it mean for 2DG to be part of the project?

• The Project aims to improve heat dissipation, optimize data transmission, implement thermal control for dense SiP modules and advance integration enhance device performance and efficiency.

• The industry largest players validate 2DG’s innovative approach and establishes its role in the semiconductor industry.

• Provides a platform for collaboration and technological advancement.

Disclaimer: “ConnectingChips” hasn’t been granted yet.

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2DG Intellectual Property

Four patent families are directed to the technology of the Company and each patent is composed of our unique production methods and materials:

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1 2

3

4

GRAPHENE COATED NON-METALLIC SURFACES, DEVICES AND METHOD

THEREOF – directed to the technologies used for conductive diffusion barrier, and other applications

GRAPHENE COATED METALLIC SURFACES, DEVICES AND METHOD OF

MANUFACTURE THEREOF – directed to the technologies used for conductive capping layer, and other applications

METHOD OF MANUFACTURE OF GRAPHENE COATED SURFACES BY ATOMIC OR MOLECULAR LAYER DEPOSITION – directed to graphene manufacture by ALD

GRAPHENE METAL COMPOSITE – directed to graphene layers interlayered with metal layers including coatings of patterned surfaces

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2D Generation’s Strong Management Team

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PAUL RICH Technology Leader

ARYE KOHAVI Founder, CEO

MIRI KISH DAGAN VP R&D

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~~magazine.~~

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AI1:ASX

Thank you

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