
TongFu Microelectronics Co.,Ltd. — Investor Relations & Filings
TongFu Microelectronics Co.,Ltd. (TFME) is a global provider of integrated circuit (IC) assembly and testing services, offering a comprehensive suite of solutions including wafer probing, bumping, assembly, and final testing. The company specializes in advanced packaging technologies such as Flip Chip (FC), Wafer Level Chip Scale Packaging (WLCSP), System-in-Package (SiP), and 2.5D/3D integration. Through strategic partnerships and the acquisition of high-performance assembly facilities, TFME has established a strong presence in the computing, communications, automotive, and consumer electronics markets. Its service portfolio addresses critical requirements for miniaturization, high-speed data transmission, and thermal efficiency, supporting the development of next-generation semiconductor applications.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2025年年度权益分派实施公告 | 2026-05-20 | Chinese | |
| 2025年度股东会决议公告 | 2026-05-08 | Chinese | |
| 北京大成(南通)律师事务所关于通富微电子股份有限公司2025年度股东会的法律意见书 | 2026-05-08 | Chinese | |
| 关于持股5%以上股东股份变动比例触及1%整数倍的公告 | 2026-05-08 | Chinese | |
| 关于2026年度开展外汇套期保值业务的公告 | 2026-04-16 | Chinese | |
| 关于召开2025年度股东会的通知 | 2026-04-16 | Chinese |
Browse filings by year
20 years- 2026 67 filings
- 2025 94 filings
- 2024 129 filings
- 2023 99 filings
- 2022 134 filings
- 2021 118 filings
- 2020 137 filings
- 2019 84 filings
- 2018 85 filings
- 2017 138 filings
- 2016 144 filings
- 2015 137 filings
- 2014 106 filings
- 2013 56 filings
- 2012 64 filings
- 2011 68 filings
- 2010 84 filings
- 2009 78 filings
- 2008 88 filings
- 2007 44 filings
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 46701195 | 2025年年度权益分派实施公告 | 2026-05-20 | Chinese | ||
| 44493860 | 2025年度股东会决议公告 | 2026-05-08 | Chinese | ||
| 44490807 | 北京大成(南通)律师事务所关于通富微电子股份有限公司2025年度股东会的法律意见书 | 2026-05-08 | Chinese | ||
| 44488083 | 关于持股5%以上股东股份变动比例触及1%整数倍的公告 | 2026-05-08 | Chinese | ||
| 34965723 | 关于2026年度开展外汇套期保值业务的公告 | 2026-04-16 | Chinese | ||
| 34965721 | 关于召开2025年度股东会的通知 | 2026-04-16 | Chinese | ||
| 34965719 | 董事会关于独立董事独立性情况的专项意见 | 2026-04-16 | Chinese | ||
| 34965718 | 国泰海通证券股份有限公司关于通富微电子股份有限公司2025年度募集资金存放与使用情况的专项核查意见 | 2026-04-16 | Chinese | ||
| 34965713 | 独立董事2025年度述职报告(王建文) | 2026-04-16 | Chinese | ||
| 34965709 | 2025年度内部控制审计报告 | 2026-04-16 | Chinese | ||
| 34965705 | 2025年度募集资金存放与实际使用情况的专项报告 | 2026-04-16 | Chinese | ||
| 34965704 | 关于通富微电子股份有限公司非经营性资金占用及其他关联资金往来的专项说明 | 2026-04-16 | Chinese | ||
| 34965703 | 通富微电子股份有限公司2025年度非经营性资金占用及其他关联资金往来情况汇总表 | 2026-04-16 | Chinese | ||
| 34965699 | 2025年年度报告摘要 | 2026-04-16 | Chinese | ||
| 34965698 | 关于续聘会计师事务所的公告 | 2026-04-16 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
BCC Fuba India Ltd.
Manufactures high-precision single-sided, double-sided, and…
|
890235 | IN | Manufacturing |
|
BCnC Co., Ltd.
A specialized manufacturer of parts and materials for semic…
|
146320 | KR | Manufacturing |
|
BeammWave AB
Specializes in digital beamforming solutions for 5G and 6G …
|
BEAMMW | SE | Manufacturing |
|
BEIJING ONMICRO ELECTRONICS CO., LTD.
Fabless designer of RF front-end components and mixed-signa…
|
688790 | CN | Manufacturing |
|
Beijing Relpow Technology Co., Ltd
Manufacturer of high-performance power modules for telecom …
|
300593 | CN | Manufacturing |
|
BEIJING YANDONG MICROELECTRONIC CO., LTD.
IDM specializing in integrated circuit design, wafer fabric…
|
688172 | CN | Manufacturing |
|
Beijing Yuanliu Hongyuan Electronic Technology Co., Ltd.
Produces high-reliability MLCCs and EMI filters for aerospa…
|
603267 | CN | Manufacturing |
|
Beken Corporation
Fabless designer of wireless communication ICs for IoT and …
|
603068 | CN | Manufacturing |
|
BEL FUSE INC /NJ
Designs and manufactures products that power, protect, and …
|
BELFA | US | Manufacturing |
|
BENCHMARK ELECTRONICS INC
Provider of design, manufacturing, and lifecycle services f…
|
BHE | US | Manufacturing |
TongFu Microelectronics Co.,Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54210/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54210 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54210 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54210 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54210}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for TongFu Microelectronics Co.,Ltd. (id: 54210)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.