
TongFu Microelectronics Co.,Ltd. — Investor Relations & Filings
TongFu Microelectronics Co.,Ltd. (TFME) is a global provider of integrated circuit (IC) assembly and testing services, offering a comprehensive suite of solutions including wafer probing, bumping, assembly, and final testing. The company specializes in advanced packaging technologies such as Flip Chip (FC), Wafer Level Chip Scale Packaging (WLCSP), System-in-Package (SiP), and 2.5D/3D integration. Through strategic partnerships and the acquisition of high-performance assembly facilities, TFME has established a strong presence in the computing, communications, automotive, and consumer electronics markets. Its service portfolio addresses critical requirements for miniaturization, high-speed data transmission, and thermal efficiency, supporting the development of next-generation semiconductor applications.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 2024年年度报告摘要 | 2025-04-11 | Chinese | |
| 2024年年度财务报告 | 2025-04-11 | Chinese | |
| 关于2025年度日常关联交易计划的公告 | 2025-04-11 | Chinese | |
| 2024年度董事会工作报告 | 2025-04-11 | Chinese | |
| 关于受让嘉兴景曜合伙份额暨与专业投资机构共同投资合伙企业的进展公告 | 2025-02-28 | Chinese | |
| 关于收购京隆科技(苏州)有限公司26%股权交割完成的公告 | 2025-02-13 | Chinese |
Browse filings by year
20 years- 2026 67 filings
- 2025 94 filings
- 2024 129 filings
- 2023 99 filings
- 2022 134 filings
- 2021 118 filings
- 2020 137 filings
- 2019 84 filings
- 2018 85 filings
- 2017 138 filings
- 2016 144 filings
- 2015 137 filings
- 2014 106 filings
- 2013 56 filings
- 2012 64 filings
- 2011 68 filings
- 2010 84 filings
- 2009 78 filings
- 2008 88 filings
- 2007 44 filings
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
11 filings
| |||||
| 34964201 | 2024年年度报告摘要 | 2025-04-11 | Chinese | ||
| 34964198 | 2024年年度财务报告 | 2025-04-11 | Chinese | ||
| 34964041 | 关于2025年度日常关联交易计划的公告 | 2025-04-11 | Chinese | ||
| 34964029 | 2024年度董事会工作报告 | 2025-04-11 | Chinese | ||
| 34964013 | 关于受让嘉兴景曜合伙份额暨与专业投资机构共同投资合伙企业的进展公告 | 2025-02-28 | Chinese | ||
| 34963998 | 关于收购京隆科技(苏州)有限公司26%股权交割完成的公告 | 2025-02-13 | Chinese | ||
| 34963986 | 关于持股5%以上股东减持计划时间届满暨减持结果公告 | 2025-02-05 | Chinese | ||
| 34963974 | 2024年度业绩预告 | 2025-01-24 | Chinese | ||
| 34963967 | 关于持股5%以上股东股份变动比例触及1%整数倍的公告 | 2025-01-20 | Chinese | ||
| 34963952 | 关于持股5%以上股东股份变动比例超过1%的公告 | 2025-01-13 | Chinese | ||
| 34963942 | 关于与专业投资机构共同投资合伙企业备案完成的公告 | 2025-01-02 | Chinese | ||
|
2024
4 filings
| |||||
| 34963934 | 关于控股股东部分股份解除质押的公告 | 2024-12-30 | Chinese | ||
| 34963923 | 关于向参股子公司增资暨关联交易的公告 | 2024-12-20 | Chinese | ||
| 34963914 | 第八届董事会第八次会议决议公告 | 2024-12-20 | Chinese | ||
| 34963907 | 第八届董事会独立董事专门会议第二次会议审核意见 | 2024-12-20 | Chinese | ||
Market data
Market data not available
Price history
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TongFu Microelectronics Co.,Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54210/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54210 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54210 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54210 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54210}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for TongFu Microelectronics Co.,Ltd. (id: 54210)"
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