
TongFu Microelectronics Co.,Ltd. — Investor Relations & Filings
TongFu Microelectronics Co.,Ltd. (TFME) is a global provider of integrated circuit (IC) assembly and testing services, offering a comprehensive suite of solutions including wafer probing, bumping, assembly, and final testing. The company specializes in advanced packaging technologies such as Flip Chip (FC), Wafer Level Chip Scale Packaging (WLCSP), System-in-Package (SiP), and 2.5D/3D integration. Through strategic partnerships and the acquisition of high-performance assembly facilities, TFME has established a strong presence in the computing, communications, automotive, and consumer electronics markets. Its service portfolio addresses critical requirements for miniaturization, high-speed data transmission, and thermal efficiency, supporting the development of next-generation semiconductor applications.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 第八届董事会独立董事专门会议第三次会议审核意见 | 2025-04-11 | Chinese | |
| 关于计提减值准备的公告 | 2025-04-11 | Chinese | |
| 内部控制自我评价报告 | 2025-04-11 | Chinese | |
| 独立董事2024年度述职报告(时龙兴) | 2025-04-11 | Chinese | |
| 年度股东大会通知 | 2025-04-11 | Chinese | |
| 2024年度利润分配预案的公告 | 2025-04-11 | Chinese |
Browse filings by year
20 years- 2026 67 filings
- 2025 94 filings
- 2024 129 filings
- 2023 99 filings
- 2022 134 filings
- 2021 118 filings
- 2020 137 filings
- 2019 84 filings
- 2018 85 filings
- 2017 138 filings
- 2016 144 filings
- 2015 137 filings
- 2014 106 filings
- 2013 56 filings
- 2012 64 filings
- 2011 68 filings
- 2010 84 filings
- 2009 78 filings
- 2008 88 filings
- 2007 44 filings
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2025
15 filings
| |||||
| 34964508 | 第八届董事会独立董事专门会议第三次会议审核意见 | 2025-04-11 | Chinese | ||
| 34964500 | 关于计提减值准备的公告 | 2025-04-11 | Chinese | ||
| 34964491 | 内部控制自我评价报告 | 2025-04-11 | Chinese | ||
| 34964480 | 独立董事2024年度述职报告(时龙兴) | 2025-04-11 | Chinese | ||
| 34964471 | 年度股东大会通知 | 2025-04-11 | Chinese | ||
| 34964455 | 2024年度利润分配预案的公告 | 2025-04-11 | Chinese | ||
| 34964411 | 2024年年度报告 | 2025-04-11 | Chinese | ||
| 34964410 | 国泰海通证券股份有限公司关于通富微电子股份有限公司使用闲置募集资金进行现金管理的核查意见 | 2025-04-11 | Chinese | ||
| 34964397 | 关于为下属控制企业提供担保的公告 | 2025-04-11 | Chinese | ||
| 34964392 | 2024年年度审计报告 | 2025-04-11 | Chinese | ||
| 34964335 | 独立董事2024年度述职报告(王建文) | 2025-04-11 | Chinese | ||
| 34964325 | 监事会决议公告 | 2025-04-11 | Chinese | ||
| 34964224 | 董事会对独立董事独立性评估的专项意见 | 2025-04-11 | Chinese | ||
| 34964218 | 关于2025年度开展外汇套期保值业务的公告 | 2025-04-11 | Chinese | ||
| 34964209 | 年度关联方资金占用专项审计报告 | 2025-04-11 | Chinese | ||
Market data
Market data not available
Price history
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TongFu Microelectronics Co.,Ltd. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/54210/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=54210 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=54210 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=54210 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 54210}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for TongFu Microelectronics Co.,Ltd. (id: 54210)"
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