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TIANMA MICROELECTRONICS CO., LTD — Investor Relations & Filings

Ticker · 000050 ISIN · CNE000000HT1 LEI · 300300KWFVVYL0LL8S83 Shenzhen Stock Exchange Manufacturing
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Filings indexed 2,760 across all filing types
Latest filing 2021-12-07 Capital/Financing Update
Country CN China
Listing Shenzhen Stock Exchange 000050

About TIANMA MICROELECTRONICS CO., LTD

https://www.tianma.cn

Tianma Microelectronics Co., Ltd. specializes in the design, manufacturing, and distribution of advanced display solutions. The company focuses on small-to-medium size display panels and modules, utilizing technologies such as Liquid Crystal Display (LCD) and Organic Light-Emitting Diode (OLED). Its product portfolio includes Low-Temperature Poly-Silicon (LTPS), Active-Matrix Organic Light-Emitting Diode (AMOLED), and flexible display technologies. Tianma serves a diverse range of global markets, including smartphones, tablets, automotive instrumentation, industrial medical equipment, wearable devices, and smart home applications. The company is recognized for its research and development capabilities in high-resolution, low-power consumption, and ultra-thin display modules, maintaining a significant position in the global supply chain for consumer electronics and professional display systems.

Recent filings

Filing Released Lang Actions
关于延长天马微电子股份有限公司2021年面向专业投资者公开发行公司债券（第二期）簿记建档时间的公告
Capital/Financing Update Classification · 95% confidence The document is an announcement regarding the extension of the book-building time for a corporate bond issuance by Tianma Microelectronics Co., Ltd. It details the bond issuance registration, the scheduled book-building time, and the extension of that time. There is no financial statement, audit report, or detailed financial data presented. The document is short (1296 characters) and serves as a notice about a financing activity related to bond issuance. This fits the category of Capital/Financing Update (CAP), which covers updates on company fundraising and financing activities.
2021-12-07 Chinese
天马微电子股份有限公司2021年面向专业投资者公开发行公司债券（第二期）信用评级报告
Audit Report / Information Classification · 95% confidence The document is a detailed credit rating report for a corporate bond issuance by Tianma Microelectronics Co., Ltd. in 2021. It includes comprehensive financial data, company background, industry analysis, credit rating conclusions, and detailed operational and financial metrics. The report is issued by China Chengxin International Credit Rating Co., Ltd. and is focused on the creditworthiness of the bond issuance, including financial ratios, business overview, and risk factors. This type of document is a standalone audit or credit rating report related to financing but is not an announcement of financing or capital changes itself. It is not an annual or interim report, earnings release, or investor presentation. It is a credit rating report, which fits best under the category of Audit Report / Information (AR), as it provides an independent credit assessment and financial analysis related to the bond issuance. H1 2021
2021-12-05 Chinese
2021年度天马微电子股份有限公司信用评级报告
Audit Report / Information Classification · 95% confidence The document is titled '2021 年度天马微电子股份有限公司信用评级报告' which translates to '2021 Annual Credit Rating Report of Tianma Microelectronics Co., Ltd.' It is issued by China Chengxin International Credit Rating Co., Ltd. The content includes detailed credit rating analysis, financial data from 2018 to 2021, industry analysis, business operations, and macroeconomic environment. The document is about a credit rating assessment rather than a financial performance report or earnings release. It is a standalone credit rating report, which fits the category of an Audit Report / Information (AR) as it involves an independent evaluation of the company's creditworthiness and financial condition, but is not a full annual report or earnings release. The document length is substantial (15,000 characters), and it contains detailed analysis and data, not just an announcement or certification. Therefore, the best fitting category is AR (Audit Report / Information). Q1 2021
2021-12-05 Chinese
天马微电子股份有限公司2021年面向专业投资者公开发行公司债券（第二期）发行公告
Capital/Financing Update Classification · 95% confidence The document is titled as an "发行公告" which translates to "Issuance Announcement" for a corporate bond issuance by 天马微电子股份有限公司 in 2021. It details the bond issuance size, terms, credit rating, underwriting syndicate, subscription procedures, risk disclosures, and other issuance-related information. It is not a financial report, earnings release, or management discussion. It is a formal announcement of a capital market financing event, specifically a bond issuance. This fits the definition of a Capital/Financing Update (CAP) as it provides updates on company fundraising and financing activities. The document length is substantial and contains detailed issuance terms and procedures, not just a brief notice or a report publication announcement. Therefore, the correct classification is CAP with high confidence.
2021-12-05 Chinese
天马微电子股份有限公司2021年面向专业投资者公开发行公司债券（第二期）募集说明书
Capital/Financing Update Classification · 95% confidence The document is a detailed prospectus for a corporate bond issuance by 天马微电子股份有限公司 in 2021. It includes extensive financial data, credit ratings, risk factors, legal proceedings, governance, and detailed financial accounting information. The document is titled as a募集说明书 (prospectus) for a public bond issuance aimed at professional investors. It contains comprehensive financial statements and analysis relevant to the bond issuance. This type of document is a capital/financing update related to fundraising activities and capital structure changes, specifically a bond issuance prospectus. It is not an annual report, earnings release, or regulatory filing. Therefore, the appropriate classification is Capital/Financing Update (CAP). The document length and detail support a high confidence score.
2021-12-05 Chinese
天马微电子股份有限公司2021年面向专业投资者公开发行公司债券（第二期）募集说明书摘要
Capital/Financing Update Classification · 95% confidence The document is titled as a "募集说明书摘要" which translates to "Prospectus Summary" for a 2021 public issuance of corporate bonds by Tianma Microelectronics Co., Ltd. It contains detailed information about the bond issuance amount, credit ratings, underwriting syndicate, financial data, risk factors, legal proceedings, and regulatory approvals. The content is focused on the issuance and offering of corporate bonds to professional investors, including financial metrics and credit rating reports. This type of document is a detailed capital raising disclosure related to financing activities rather than a general annual report, earnings release, or management discussion. It is not a brief announcement or a certification but a substantive document describing the bond issuance and related financial and legal information. Therefore, the most appropriate classification is Capital/Financing Update (CAP).
2021-12-05 Chinese

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