
Sai MicroElectronics Inc. — Investor Relations & Filings
Sai MicroElectronics Inc. is a global pure-play MEMS (Micro-Electro-Mechanical Systems) foundry service provider. The company specializes in the development and high-volume manufacturing of diverse MEMS devices, including sensors, actuators, and micro-structures. Its core technical capabilities include advanced process technologies such as Through-Silicon Via (TSV), wafer bonding, and deep reactive-ion etching. Sai MicroElectronics serves a broad range of end-markets, including automotive, telecommunications, industrial, medical, and consumer electronics. The company operates advanced fabrication facilities that support the full lifecycle of product development, from initial prototyping to large-scale mass production. It focuses on providing customized process solutions and high-precision micro-system integration to meet the specific requirements of global technology clients.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于获得投资收益的公告 | 2021-12-27 | Chinese | |
| 关于控股股东股票质押式回购交易提前购回的公告 | 2021-12-24 | Chinese | |
| 关于控股股东、实际控制人协议转让公司部分股票过户完成的公告 | 2021-12-23 | Chinese | |
| 关于控股子公司转让参股子公司部分股权的公告 | 2021-12-21 | Chinese | |
| 关于完成工商变更登记的公告 | 2021-12-21 | Chinese | |
| 关于控股股东进行股票质押式回购交易的公告 | 2021-12-15 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2021
15 filings
| |||||
| 37277798 | 关于获得投资收益的公告 | 2021-12-27 | Chinese | ||
| 37277786 | 关于控股股东股票质押式回购交易提前购回的公告 | 2021-12-24 | Chinese | ||
| 37277770 | 关于控股股东、实际控制人协议转让公司部分股票过户完成的公告 | 2021-12-23 | Chinese | ||
| 37277757 | 关于控股子公司转让参股子公司部分股权的公告 | 2021-12-21 | Chinese | ||
| 37277748 | 关于完成工商变更登记的公告 | 2021-12-21 | Chinese | ||
| 37277735 | 关于控股股东进行股票质押式回购交易的公告 | 2021-12-15 | Chinese | ||
| 37277716 | 关于参股子公司完成私募基金管理人备案的公告 | 2021-12-15 | Chinese | ||
| 37277710 | 关于瑞典子公司收购德国产线资产的公告 | 2021-12-14 | Chinese | ||
| 37277693 | 关于召开2021年第三次临时股东大会的通知 | 2021-12-14 | Chinese | ||
| 37277682 | 第四届董事会第二十次会议决议公告 | 2021-12-14 | Chinese | ||
| 37277668 | 关于补选公司第四届监事会非职工代表监事的公告 | 2021-12-14 | Chinese | ||
| 37277658 | 第四届监事会第十七次会议决议公告 | 2021-12-14 | Chinese | ||
| 37277641 | 关于瑞典子公司完成工商变更登记的公告 | 2021-12-13 | Chinese | ||
| 37277631 | 关于全资子公司对外投资的公告 | 2021-12-10 | Chinese | ||
| 37277624 | 关于公司监事辞任的公告 | 2021-12-09 | Chinese | ||
Market data
Market data not available
Price history
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Sai MicroElectronics Inc. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/55443/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=55443 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=55443 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=55443 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 55443}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for Sai MicroElectronics Inc. (id: 55443)"
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