HANMI Semiconductor CO., LTD. — Investor Relations & Filings
HANMI Semiconductor is a global manufacturer of equipment for the back-end or post-processing stages of semiconductor production. The company develops and supplies a wide range of machinery used for chip assembly and packaging. Its core product portfolio includes advanced Thermal Compression (TC) Bonders, which are essential for producing High Bandwidth Memory (HBM) and for 3D packaging. Other key products include Vision Placement systems, micro SAW for wafer cutting, EMI Shielding equipment, and various laser and inspection systems. The company serves a global customer base of semiconductor manufacturers, providing critical equipment for the final stages of integrated circuit production.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 기업설명회(IR)개최(안내공시) | 2024-08-21 | Korean | |
| 반기보고서 (2024.06) | 2024-08-14 | Korean | |
| 기업설명회(IR)개최(안내공시) | 2024-08-14 | Korean | |
| 주식등의대량보유상황보고서(일반) | 2024-08-09 | Korean | |
| 연결재무제표기준영업(잠정)실적(공정공시) | 2024-07-26 | Korean | |
| 유형자산취득결정(자율공시) | 2024-07-23 | Korean |
Browse filings by year
9 years| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2024
15 filings
| |||||
| 8086870 | 기업설명회(IR)개최(안내공시) | 2024-08-21 | Korean | ||
| 8091364 | 반기보고서 (2024.06) | 2024-08-14 | Korean | ||
| 8091179 | 기업설명회(IR)개최(안내공시) | 2024-08-14 | Korean | ||
| 8098670 | 주식등의대량보유상황보고서(일반) | 2024-08-09 | Korean | ||
| 8105083 | 연결재무제표기준영업(잠정)실적(공정공시) | 2024-07-26 | Korean | ||
| 8106814 | 유형자산취득결정(자율공시) | 2024-07-23 | Korean | ||
| 8106548 | 신탁계약에의한취득상황보고서 | 2024-07-23 | Korean | ||
| 8107219 | 주요사항보고서(자기주식취득신탁계약체결결정) | 2024-07-22 | Korean | ||
| 8108481 | 신탁계약해지결과보고서 | 2024-07-17 | Korean | ||
| 8109022 | 임원ㆍ주요주주특정증권등소유상황보고서 | 2024-07-16 | Korean | ||
| 8109021 | 주식등의대량보유상황보고서(일반) | 2024-07-16 | Korean | ||
| 8109019 | 최대주주등소유주식변동신고서 | 2024-07-16 | Korean | ||
| 8108830 | 주요사항보고서(자기주식취득신탁계약해지결정) | 2024-07-16 | Korean | ||
| 8110187 | 기업설명회(IR)개최(안내공시) | 2024-07-12 | Korean | ||
| 8112141 | 연결재무제표기준영업실적등에대한전망(공정공시) | 2024-07-08 | Korean | ||
Market data
Market data not available
Price history
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HANMI Semiconductor CO., LTD. via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/16499/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=16499 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=16499 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=16499 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 16499}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for HANMI Semiconductor CO., LTD. (id: 16499)"
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