COMPEQ — Investor Relations & Filings
Compeq Manufacturing Co., Ltd. specializes in the professional manufacturing and design of advanced printed circuit boards (PCBs). Established in 1973, the company focuses on high-complexity solutions, including High-Density Interconnect (HDI) PCBs, Rigid-Flex Printed Circuit Boards (RFC), and multi-layer boards. Its product applications span a wide range of technological sectors, supporting the development of servers, workstations, notebook computers, and desktop systems. Compeq also provides specialized components for mobile communication devices, networking equipment, and high-current power supplies. By leveraging integrated design-for-manufacturing (DFM) capabilities and sophisticated production processes, the company delivers high-performance interconnect technologies that meet the rigorous specifications of global electronics hardware providers.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 115年5月公開說明書 — 202605_2313_B011.pdf | 2026-05-19 | Chinese | |
| 115年5月公開說明書 — 200412_2313_B04.zip | 2026-05-19 | Chinese | |
| 115年5月公開說明書 — 200409_2313_B011.zip | 2026-05-19 | Chinese | |
| 115年5月公開說明書 — 200407_2313_B05.zip | 2026-05-19 | Chinese | |
| 115年5月公開說明書 — 200403_2313_B021.zip | 2026-05-19 | Chinese | |
| 115年5月公開說明書 — 200310_2313_B1b1.zip | 2026-05-19 | Chinese |
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 46541172 | 115年5月公開說明書 — 202605_2313_B011.pdf | 2026-05-19 | Chinese | ||
| 46524558 | 115年5月公開說明書 — 200412_2313_B04.zip | 2026-05-19 | Chinese | ||
| 46524551 | 115年5月公開說明書 — 200409_2313_B011.zip | 2026-05-19 | Chinese | ||
| 46524545 | 115年5月公開說明書 — 200407_2313_B05.zip | 2026-05-19 | Chinese | ||
| 46524536 | 115年5月公開說明書 — 200403_2313_B021.zip | 2026-05-19 | Chinese | ||
| 46524529 | 115年5月公開說明書 — 200310_2313_B1b1.zip | 2026-05-19 | Chinese | ||
| 46524525 | 115年5月公開說明書 — 200309_2313_B05.wdl | 2026-05-19 | Chinese | ||
| 46524523 | 115年5月公開說明書 — 200307_2313_B021.wdl | 2026-05-19 | Chinese | ||
| 46524522 | 115年5月公開說明書 — 200005_2313_B05_0.zip | 2026-05-19 | Chinese | ||
| 45694533 | 115年05月僑外投資持股 | 2026-05-11 | Chinese | ||
| 45566877 | 115年第1季財務報告書 — 202601_2313_AI1.pdf | 2026-05-10 | Chinese | ||
| 41309664 | 公告本公司資金貸與他人之餘額符合公開發行公司資金貸與及背書 保證處理準則第二十二條第一項第一款 | 2026-05-05 | Chinese | ||
| 40824923 | 115年04月內部人持股異動(事後) | 2026-05-04 | Chinese | ||
| 40824912 | 115年04月董事會成員及持股 | 2026-05-04 | Chinese | ||
| 39035497 | 115年年報及股東會資料 — 2026_2313_20260528F17.pdf | 2026-04-30 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
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MAXIO TECHNOLOGY (HANGZHOU) CO., LTD.
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MAXLINEAR, INC
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MAXONE SEMICONDUCTOR (SUZHOU) CO., LTD.
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|
Maxscend Microelectronics Company Limited
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|
300782 | CN | Manufacturing |
COMPEQ via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/52002/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=52002 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=52002 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=52002 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 52002}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for COMPEQ (id: 52002)"
Report missing filing
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