
BOE TECHNOLOGY GROUP CO., LTD — Investor Relations & Filings
BOE Technology Group Co., Ltd. is a global provider of semiconductor display technologies and IoT solutions. The company specializes in the research, development, and manufacturing of advanced display products, including high-resolution LCDs, flexible OLEDs, and micro-LEDs for smartphones, tablets, laptops, monitors, and televisions. Its portfolio extends to sensors, smart systems, and healthcare services, driven by a "Display plus IoT" strategy. This approach integrates display technology with artificial intelligence and big data to provide smart solutions for automotive, retail, and urban infrastructure. The company is characterized by its significant investment in research and development, maintaining a vast patent portfolio in flexible AMOLED and next-generation visual technologies. BOE focuses on delivering high-performance, energy-efficient components and integrated systems to global technology manufacturers and service providers.
Recent filings
| Filing | Released | Lang | Actions |
|---|---|---|---|
| 关于公司签署合作备忘录的风险提示公告 | 2026-05-21 | Chinese | |
| 关于与康宁公司签署合作备忘录的公告 | 2026-05-20 | Chinese | |
| 关于回购公司股份比例达到2%暨回购进展公告 | 2026-05-11 | Chinese | |
| 关于回购公司股份的进展公告 | 2026-05-07 | Chinese | |
| 独立董事候选人声明与承诺(胡晓林) | 2026-03-31 | Chinese | |
| 关于选举胡晓林先生为公司第十一届董事会独立董事的公告 | 2026-03-31 | Chinese |
Browse filings by year
26 years- 2026 56 filings
- 2025 189 filings
- 2024 165 filings
- 2023 150 filings
- 2022 216 filings
- 2021 183 filings
- 2020 171 filings
- 2019 132 filings
- 2018 86 filings
- 2017 96 filings
- 2016 172 filings
- 2015 144 filings
- 2014 124 filings
- 2013 123 filings
- 2012 71 filings
- 2011 113 filings
- 2010 108 filings
- 2009 108 filings
- 2008 94 filings
- 2007 128 filings
- 2006 78 filings
- 2005 112 filings
- 2004 59 filings
- 2003 57 filings
- 2002 28 filings
- 2001 10 filings
| ID | Filing | Released | Lang | Actions | |
|---|---|---|---|---|---|
|
2026
15 filings
| |||||
| 46757451 | 关于公司签署合作备忘录的风险提示公告 | 2026-05-21 | Chinese | ||
| 46701861 | 关于与康宁公司签署合作备忘录的公告 | 2026-05-20 | Chinese | ||
| 45016991 | 关于回购公司股份比例达到2%暨回购进展公告 | 2026-05-11 | Chinese | ||
| 44266933 | 关于回购公司股份的进展公告 | 2026-05-07 | Chinese | ||
| 43452501 | 独立董事候选人声明与承诺(胡晓林) | 2026-03-31 | Chinese | ||
| 43452464 | 关于选举胡晓林先生为公司第十一届董事会独立董事的公告 | 2026-03-31 | Chinese | ||
| 43452427 | 2025年年度报告摘要 | 2026-03-31 | Chinese | ||
| 43452421 | 京东方科技集团股份有限公司2026年限制性股票激励计划考核管理办法 | 2026-03-31 | Chinese | ||
| 43452387 | 关于回购公司境内上市外资股份(B股)方案的公告 | 2026-03-31 | Chinese | ||
| 43452378 | 独立董事2025年度述职报告(唐守廉) | 2026-03-31 | Chinese | ||
| 43452344 | 关于举行业绩网上说明会并征集相关问题的公告 | 2026-03-31 | Chinese | ||
| 43452312 | 董事及高级管理人员薪酬管理办法 | 2026-03-31 | Chinese | ||
| 43452303 | 独立董事提名人声明与承诺(胡晓林) | 2026-03-31 | Chinese | ||
| 43452261 | 第十一届董事会第十二次会议决议公告 | 2026-03-31 | Chinese | ||
| 43452210 | 关于京东方科技集团股份有限公司2025年度非经营性资金占用及其他关联资金往来情况的专项说明 | 2026-03-31 | Chinese | ||
Market data
Market data not available
Price history
Peer group · Manufacture of other electronic components and boards
| Company | Ticker | Country | Sector |
|---|---|---|---|
|
Hengxin Technology Ltd.
Specializes in RF coaxial cables and antennas, with diversi…
|
1085 | HK | Manufacturing |
|
HG Semiconductor Limited
Designs, develops, and sells semiconductor products, includ…
|
6908 | KY | Manufacturing |
|
HiDeep Inc.
Develops UI/UX solutions and pressure-sensitive 3D Touch te…
|
365590 | KR | Manufacturing |
|
Highbroad Advanced Material (Hefei) Co., Ltd.
Develops optical components and backlight modules for the g…
|
301321 | CN | Manufacturing |
|
Highness Microelectronics Limited
Develops advanced display solutions and embedded systems fo…
|
544741 | IN | Manufacturing |
|
Himax Technologies, Inc.
A fabless semiconductor provider of display imaging process…
|
HIMX | KY | Manufacturing |
|
HIRAKAWA HEWTECH CORP.
Manufacturer of cables, assemblies, and electronic and medi…
|
5821 | JP | Manufacturing |
|
HIROSE ELECTRIC CO.,LTD.
A global manufacturer of high-performance electronic connec…
|
6806 | JP | Manufacturing |
|
HI-TREND TECHNOLOGY (SHANGHAI) CO.,LTD
Fabless semiconductor firm specializing in energy metering …
|
688391 | CN | Manufacturing |
|
HLB innoVation Co.,Ltd.
Designs and manufactures lead frames for semiconductors and…
|
024850 | KR | Manufacturing |
BOE TECHNOLOGY GROUP CO., LTD via the API
Pull this company's filings, identifiers, and metadata as JSON or Markdown. Authenticate with your API key, then query by company ID, ISIN, or LEI. Full schema documented in the OpenAPI spec.
Endpoints
| GET | /api/companies/53782/ | Company identity, sector, listing, identifiers |
| GET | /api/filings/?company=53782 | Paginated list of all filings (filterable by type, date, language) |
| GET | /api/filings/{id}/ | Single filing — metadata, document URL, processing status |
| GET | /api/filings/{id}/markdown/ | Filing content as Markdown (PDF → text/tables/figures) |
| GET | /api/isins/?company=53782 | All ISINs registered to this company |
| GET | /api/filing-types/ | Reference: every filing-type code + category |
cURL
$ curl https://api.financialreports.eu/api/filings/?company=53782 \ -H "x-api-key: $FR_API_KEY" \ -H "Accept: application/json"
Python
import requests r = requests.get( "https://api.financialreports.eu/api/filings/", params={"company": 53782}, headers={"x-api-key": API_KEY}, ) filings = r.json()["results"]
MCP server
// MCP server URL https://mcp.financialfilings.com/mcp // Once connected, the LLM can query this company directly: "Pull the latest 5 filings for BOE TECHNOLOGY GROUP CO., LTD (id: 53782)"
Report missing filing
Can't find a specific document? Let us know and we'll add it within 24 hours.